Raytheon Company

The Boeing Company

Richard F Davis

Ralph D Hermansen

E Dean Johnston

Lawrence S Mills

Methods and apparatus are provided for an interconnect system for coupling radio frequency signals from one component to another in a RF system. The interconnect system acts as a coaxial connection. The apparatus comprises an interconnect, a dielectric sleeve, and a conductive elastomeric gasket. The interconnect has a first major surface and second major surface for providing an electrical connection. A through hole is formed in a first component. The dielectric sleeve is placed in the through hole. The interconnect is placed in the dielectric sleeve. The conductive elastomeric gasket is placed in proximity to the through hole contacting the first component and a second component. The RF system is assembled compressing the elastomeric gasket to have intimate contact with the first and second component. The intimate contact electrically connects the first and second component and an electric shield is formed around the interconnect thereby suppressing the reception and transmission of RF signals.

High frequency and low noise interconnect system

An adhesive and method for attaching a heat sink to a printing wiring assembly that provides a thermal path from electronic components on the printing wiring assembly to the heat sink. The adhesive is flexible and accommodates thermal expansion stresses and is readily reworkable. The adhesive comprises a filler material that is disposed between the heat sink and the printing wiring assembly, and an impregnant that impregnates the filler material, which impregnated filler material is cured. The filler material may comprise alumina particles that have a spherical shape. The impregnant comprises a polymer, typically selected from a group of epoxy resins and their curatives that form a flexible material when cured. In practicing the method, a heat sink is positioned adjacent to and spaced apart from a printing wiring assembly to provide an appropriate spacing between them. The periphery of the printing wiring assembly is sealed. A cavity that is formed between the heat sink and the printing wiring assembly is filled with a filler material. The filled assembly is vibrated to maximize packing density of the filler material. The filler material is then impregnated with a flexible epoxy impregnant. The impregnant is then cured to form the flexible adhesive. This produces a structure wherein the heat sink is bonded to the printed wiring assembly.

Reworkable, thermally-conductive adhesives for electronic assemblies

A thermally conductive wedgelock having improved thermal conductivity is used to secure a circuit card assembly in a card guide slot formed in a housing of an electronics package. The circuit card assembly has a thermal mounting plate that is used to secure the assembly in the slot. The thermally conductive wedgelock secures the circuit card assembly in the housing and conductively couples heat from the circuit card assembly to the housing by way of the card guide slot. The wedgelock provides a secondary heat path to the card guide slot to housing in addition to the primary heat path through the thermal mounting plate. Apparatus is provide for expanding the wedgelock in the card guide slot to secure the circuit card assembly therein. The thermally conductive wedgelock may be made of copper or other metal having high thermal conductivity. The wedgelock preferably comprises two tapered wedges, and has a guide that prevents rotation between the adjacent wedges.

Growing community of inventors

La Habra, CA, United States of America

Richard F Davis