Saint-Gobain Ceramics & Plastics, Inc.

Other

Norton Company

Coorstek, Inc.

Richard F Buckley

Andrew G Haerle

Bradley J Miller

Yeshwanth Narendar

John V Hagan

Mianxue Wu

Richard R Hengst

David M Duarte

John T Vayda

A semiconductor processing component has an outer surface portion comprised of silicon carbide, the outer surface portion having a skin impurity level and a bulk impurity level. The skin impurity level is average impurity level from 0 nm to 100 nm of depth into the outer surface portion, the bulk impurity level is measured at a depth of at least 3 microns into the outer surface portion, and the skin impurity level is not greater than 80% of the bulk impurity level.

Method for treating semiconductor processing components and components formed thereby

A high purity ceramic article having a typical pore size of at least about 15 &#x3bc;m and an active impurity concentration of less than about 400 ppm can be prepared by molding ceramic powder, sintering to vaporize any active impurity components, washing to dissolve any remaining active impurity components with an acid solution, and oxidizing to remove any residual active impurity components.

High purity silicon carbide wafer boats

A horizontal wafer boat for maintaining semiconductor wafers during wafer processing is disclosed. The wafer boat is configured to reduce the likelihood wafer slip when wafers are heated to processing temperatures of about 1000&#xb0; C. and above.

Slip resistant horizontal semiconductor wafer boat

A method for treating a semiconductor processing component, including: exposing the component to a halogen gas at an elevated temperature, oxidizing the component to form an oxide layer, and removing the oxide layer.

A silicon carbide cantilever paddle for use in semiconductor wafer processing is disclosed. The cantilever paddle is characterized in that it exhibits acceptable deflection characteristics over the entire range of weight loads with which it may be used, and that it is compatible with existing clamp systems. This is achieved by providing a &ldquo;two-stage&rdquo; handle having a large diameter section and a small diameter section, the sections being separated by a handle transition zone.

Silicon carbide cantilever paddle

A vertical ceramic wafer boat for supporting a silicon wafer having a predetermined radius &ldquo;R&rdquo;. The wafer boat comprises a base portion and a column rack, which extends generally vertically upwards from the base portion. The column rack includes a pair of vertical column rack supports extending generally vertically upwards from the base portion. The column rack also includes a plurality of wafer supports having a generally Y shaped cross section. The wafer supports extend substantially horizontally from the column rack supports to define a plurality of slots within the column rack sized to receive the wafer.

Single cast vertical wafer boat with a Y shaped column rack

A vertical ceramic wafer boat for supporting a silicon wafer having a predetermined radius R. The wafer boat comprises a base and a pair of column racks. The column racks extend generally vertically upwards from the base. Each column rack includes at least one arm having an arcuate section. Each arcuate section is sized to provide substantial support for a 0.7 R boundary region of the wafer and spans an arc of less than 180 degrees.

Wafer boat with arcuate wafer support arms

A grinding wheel is provided for grinding the fire deck of an engine block. The grinding wheel, includes a first annular grinding element disposed concentrically with the wheel on a backing plate. The first annular grinding element includes a first abrasive component of either metal brazed single layer abrasive components or abrasive components comprising grain bonded in a porous matrix having about 55 to 80 volume percent interconnected porosity. The wheel preferably has a second annular grinding element disposed concentrically inward of the first annular grinding element. The first annular grinding element preferably comprises a single layer of relatively course diamond abrasive component brazed on a metallic substrate, while the second annular grinding element preferably comprises a single layer of relatively fine diamond abrasive components brazed on a similar substrate. Each of the first and second grinding elements are formed as a discrete units individually fastened to the backing plate to facilitate independent height adjustment of the annular grinding elements relative the backing plate. Fabrication of the first and second annular grinding elements as discrete members individually fastened to the backing plate serves to simplify both assembly of the wheel and height adjustment of the first and second annular grinding elements relative one another. Although one piece annular grinding elements are contemplated, each element may be fabricated as multi-part assemblies, such as two 180 degree or four 90 degree portions in order to prevent the accumulation of stresses and distortion during high speed testing.

Grinding wheel for grinding material from bimetallic surfaces

A method is provided for machining the fire deck of an engine block. The method includes providing a grinding wheel having an outer annular grinding element disposed concentrically or the wheel may be provided with an inner annular grinding element disposed concentrically inward of an outer element. The outer element comprises a single layer of relatively coarse diamond abrasive brazed on a metallic substrate, while the inner element comprises a single layer of relatively fine diamond abrasive brazed on a similar substrate. The outer grinding element and the inner element if utilized, is formed as a discrete unit individually fastened to a backing plate to facilitate independent height adjustment of the elements relative the backing plate. The method further comprises orienting the grinding wheel with its axis of rotation at a predetermined oblique angle a relative the fire deck. The wheel is then translated towards the engine block along a tool path parallel to the fire deck wherein the outer ring will engage the block for bulk material removal, followed by the inner ring, if utilized, which removes a smaller amount of material to apply the requisite surface finish to the fire deck.

Growing community of inventors

Shrewsbury, MA, United States of America

Richard F Buckley