Freescale Semiconductor,inc.

Nxp Usa, Inc.

Powerwave Technologies, Inc.

Nxp B.v.

Richard Emil Sweeney

Joseph Staudinger

Paul Richard Hart

Mario M Bokatius

Abdulrhman M S Ahmed

Jason Snodgress

Kevin Kim

Ahmad Khanifar

Nikolai Maslennikov

Vikas Shilimkar

Chuming Shih

Eric Johnson

Abdulrhman Ms Ahmed

Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.

RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array

Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first circuit and a second circuit in parallel with the first circuit. The first circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first attenuator series coupled between the first input and the first output. The second circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter coupled between the second input and the second output.

Phase shift and attenuation circuits for use with multiple-path amplifiers

Embodiments of circuits for use with an amplifier that includes multiple amplifier paths include a first series circuit and a second series circuit in parallel with the first series circuit. The first series circuit includes a first input coupled to a first power divider output, a first output coupled to a first amplifier path of the multiple amplifier paths, and a first adjustable phase shifter and a first adjustable attenuator series coupled between the first input and the first output. The second series circuit includes a second input coupled to a second power divider output, a second output coupled to a second amplifier path of the multiple amplifier paths, and a second adjustable phase shifter and a second adjustable attenuator series coupled between the second input and the second output.

An adjustable power splitter includes: a power divider with an input and a first and second divider output; a first adjustable phase shifter and first adjustable attenuator series coupled to the first divider output and providing a first power output; a second adjustable phase shifter and second adjustable attenuator series coupled to the second divider output and providing a second power output; an interface; and a controller. The controller is configured to receive, via the interface, data indicating phase shifts to be applied by the first and second adjustable phase shifters and attenuation levels to be applied by the first and second adjustable attenuators, and to control, based on the data, the phase shifts and attenuation levels applied by the first and second adjustable phase shifters and the first and second adjustable attenuators.

Adjustable power splitter and corresponding methods and apparatus

An adjustable power splitter includes: a power divider with an input and a first and second divider output; a first adjustable phase shifter and first adjustable attenuator series coupled to the first divider output and providing a first power output; and a second adjustable phase shifter and second adjustable attenuator series coupled to the second divider output and providing a second power output.

A radio frequency power amplifier has first and second amplifier transistors. The first and second amplifier transistors have a common element thereof electrically interconnected with a common bus. A forked conductor having two legs thereof electrically connected to the common bus, each leg having a distal end proximate one of the first and second amplifier transistors. The common bus and the forked conductor are generally symmetric about an axis about which the first and second amplifier transistors are symmetrically disposed.

Balanced radio frequency power amplifier with temperature compensation

Methods of assembling a coupler are provided in which a first printed circuit board is provided, and a second printed circuit board is then surface mounted on the first printed circuit board. The first printed circuit board and the second printed circuit board are then electrically and mechanically connected to provide a coupler having a shielded region defined between the first printed circuit board and the second printed circuit board. The shielded region at least partly surrounds a coupler circuit disposed therein.

Low cost highly isolated RF coupler

A surface mount technology ('SMT') apparatus for use in routing radio frequencies ('RF') between cavities that require a high level of isolation on a single printed circuit board (&#x201c;PCB&#x201d;). The SMT part is attached to the PCB over a stripline-ready trace which transitions to microstrip before and after the SMT stripline part to maintain consistent characteristic impedance. When presented with a high isolation need between two cavities using microstrip transmission lines, the proposed stripline SMT apparatus under the isolation wall will tend to provide the necessary isolation. The present invention provides a repeatable and reliable interconnect while improving the electrical match between the two cavities. Furthermore, the invention removes the costs associated with manually forming and soldering cables between PCBs.

System and method of providing highly isolated radio frequency interconnections

An RF pallet ground comprises overhangs disposed at opposite ends. Each overhang includes a downwardly protruding ledge and a notch defined in a bottom surface of the pallet. The ledges and notches extend from one side of the pallet to the other. The ledge provides a positive connection directly to ground. The ledge has a length shorter than the length of the main body of the pallet. Fasteners are positioned on either side of an RF trace on the pallet, allowing positive pressure to be applied to the ground through the ledge.

Growing community of inventors

Chandler, AZ, United States of America

Richard Emil Sweeney