Minnesota Mining and Manufacturing Company

3m Innovative Properties Company

Richard E Bennett

Greggory S Bennett

Louis E Winslow

David James Yarusso

Cheryl L Moore

Michele A Craton

Timothy D Bredahl

Shih-Hung Chou

Daniel C Munson

Anthony R Plepys

Karunasena A Alahapperuma

Robert L Smith

Harold W Leverty

Babu Nana Gaddam

Larry R Krepski

Steven M Heilmann

David B Olson

Brant Ulrick Kolb

Wayne K Larson

David S Arney

Gary K Kuhn

Mark K Nestegard

Gerald C Bird

Jack L Perecman

Nicole L Franchina

Donald V Flatt

Thomas S Overstreet

Gary L Romberg

Kevin J Bangen

Eleanor Rudin

Mary A Hittner

Polycarbonate articles and adhesive composition therefor

An article is disclosed that includes a) a first polycarbonate substrate; b) a second polycarbonate substrate; and c) an adhesive composition disposed between the first polycarbonate substrate and the second polycarbonate substrate such that the first polycarbonate substrate is bonded to said second polycarbonate substrate through the adhesive composition; the adhesive composition includes an adhesive polymer that includes the reaction product of 1) an N-vinyl containing monomer selected from the group consisting of N-vinyl caprolactam, N-vinyl pyrrolidone, and N-vinyl imidazole, and combinations thereof, and 2) an acrylic acid ester monomer of a non-tertiary alcohol having an alkyl group that includes 4 to 20 carbon atoms.

A semiconductor wafer processing tape includes a permanent backing and a layer of a nonpressure sensitive adhesive. The tapes are useful for wafer grinding and/or wafer dicing applications. The nonpressure sensitive adhesive includes a copolymer of at least one of a first monoethylenically unsaturated monomer, at least one of a second monoethylenically unsaturated monomer, and at least one copolymerizable nonionic crosslinking agent; wherein the second monoethylenically unsaturated monomer is a reinforcing monomer having a homopolymer glass transition temperature higher than that of the first monoethylenically unsaturated monomer. A method of processing semiconductor wafers is also provided.

Semiconductor wafer processing tapes

The present invention relates to a composition comprising a first monomer having the formula CH &boxH;CHCOOR , where R is a linear alkyl group having from 9 to 16 carbon atoms or a branched alkyl group having from 9 to 30 carbon atoms, and whose homopolymer has a Tg less than 0&deg; C.; and/or a second monomer having the formula CH &boxH;CHCOOR , where R is an alkyl group having at least 9 carbon atoms whose homopolymer has a Tg greater than 15&deg; C.; and a third component which may be another monomer, a polymer, surface-modified particles, or combinations thereof as well as article comprising the composition.

Compositions and articles made therefrom

Methods and apparatus for applying a bonding layer to a member of an optical recording medium and for bonding together members of an optical recording medium. The methods and apparatus are useful for assembling optical recording media such as compact disks (CDs) and digital versatile disks (DVDs), and are particularly well suited for use with pressure sensitive adhesives. A preferred method of assembling together first and second members of an optical recording medium, wherein each of the members includes an inner surface and an outer surface, wherein at least one of the inner surfaces includes a bonding layer thereon, and wherein at least one of the members includes a data storage surface, includes the steps of: a) curving the first member such that the first member inner surface is convex, wherein the first member inner surface includes an outer annulus, and wherein the outer annulus includes a first portion and a second portion; b) orienting the second member such that the second member inner surface faces the first member inner surface, wherein the second member inner surface includes an outer annulus, and wherein the outer annulus includes a first portion and a second portion; c) contacting the first portion of the first member outer annulus and the first portion of the second member outer annulus together under pressure; and d) rotating the first and second members relative to one another so as to progressively contact under pressure the first member inner surface and second member inner surface together from their respective outer annulus first portions to their respective outer annulus second portions to thereby attach together the inner surfaces of the first and second members. A similar method for applying the bonding layer to one member is disclosed. Also disclosed are apparatus for use with the above methods.

Method and apparatus for assembling an optical recording medium

A semiconductor wafer processing tape comprises a permanent backing and a layer of a non-pressure sensitive adhesive comprising a thermoplastic elastomer block copolymer on the permanent backing. Optionally, the adhesive may include an adhesion modifier such as a tackifying resin, a liquid rubber or a photocrosslinking agent. The tapes are useful for both wafer grinding and wafer dicing applications. A method of processing semiconductor wafers is disclosed.

Semiconductor wafer processing adhesives and tapes

A water dispersible polymeric composition comprises at least one sulfo group containing segment, which group comprises at least one urethane or urea connecting group, said composition also comprising at least one hydrophobic segment, which segment comprises at least one urethane or urea connecting group. The composition when dried can provide a coating on a substrate or an article having low surface energy and preferably ink receptive properties. The article can provide release capabilities towards adhesives, particularly pressure sensitive adhesives.

Low-surface energy sulfo-polyurethane or sulfo-polyurea compositions

A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.

Solventless compounding and coating of non-thermoplastic hydrocarbon

The pressure-sensitive adhesive layer of the novel tape, like that of Silver U.S. Pat. No. 3,922,464, comprises a copolymer of alkyl acrylate such as isooctyl acrylate and a small amount of emulsifier monomer. The novel tape differs from that of Silver by incorporating tackifier resin, thus better resisting lifting forces at elevated temperatures while also being cleanly removable.

Removable pressure-sensitive adhesive tape

A dry transfer article comprising a carrier film bearing a graphic design in the form of one or more layers of ink and an actinic radiation responsive adhesive overlapping the design, the ink serving as a mask to actinic radiation such that only adhesive in non-ink areas is exposed to radiation creating a differential adhesive tack which allows the article to be positioned on the substrate and the carrier film and exposed adhesive to be selectively removed leaving the graphic design and underlying unexposed adhesive bonded to the substrate.

Dry transfer article

'Release on demand' pressure-sensitive adhesives and tapes which are readily detackifiable by exposure to actinic radiation. The adhesive system has an oxirane ring-bearing component blended thereinto (or preferably reacted therewith) to achieve an adhesive epoxy equivalent value of 400-900, preferably 450-700. The adhesive system also includes an effective amount of ionic photoinitiator capable of promoting the polymerization of oxirane rings.

Pressure-sensitive adhesive susceptible to ultraviolet light-induced

Growing community of inventors

Hudson, WI, United States of America

Richard E Bennett