Kulicke and Soffa Industries, Inc.

Kulicke and Soffa Investments, Inc.

Sv Probe Pte. Ltd.

Kulicke & Soffa Ind. Inc.

Richard Deward Sadler

Michael P Schmidt-Lange

E Walter Frasch

Frederick W Kulicke, Jr

Bahadir Tunaboylu

Gary S Gillotti

Edward T Laurent

Edward Lambert Malantonio

James M Weaver

David A Leonhardt

Eugene W Frasch

Dov Chartarifsky

Robert B Newsome

An approach is provided for fabricating cantilever probes. The approach generally includes using various techniques to secure a cantilever probe in a manner to allow a tip to be created on the cantilever probe. For example, embodiments of the invention include attaching the cantilever probe to a carrier structure by clamping the cantilever probe to the carrier structure, bonding the cantilever probe to the carrier structure via a post feature on the cantilever probe, or applying a material on the carrier structure and substantially around and in contact with the cantilever probe to affix the cantilever probe to the carrier structure. A probe tip can then be formed on the cantilever probe while the cantilever probe is attached or affixed to the carrier structure. The cantilever probe can then be removed and bonded to a probe substrate.

Approach for fabricating cantilever probes

A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.

Bond head link assembly for a wire bonding machine

A wire bonding machine includes (1) a support structure for supporting a work piece and (2) a pre-heat structure for supporting the work piece during a pre-heat operation. The pre-heat structure is moveable with respect to the support structure.

Wire bonding apparatus and process

Wire bonding apparatus

A bond head for use with a bonding machine. The bond head has an arm assembly; and a linkage coupled between the arm assembly and the frame of the bonding machine. The linkage forms a virtual pivot point below a lower surface of the arm assembly.

Linkage guided bond head

A low mass self-aligning wire clamp jaw assembly is provided which may be employed as a replaceable wire clamp jaw assembly or as a complete integrated wire clamp assembly with an actuator. The novel self-aligning wire clamp jaw assembly comprises a wire clamp jaw mounting arm which is adapted to be connected to a bonding head support. The wire clamp jaw mounting arm serves as a fixed lever to which is attached a first fixed flat surface clamping jaw and also serves as a mount to which a second and pivotal jaw is positioned juxtaposed the first jaw. A force mounting spring is also mounted on the mounting arm for applying a unidirectional force to one end of the second pivotal jaw to bias the pivotal jaw in a normally open or normally closed position. A force adjusting screw is further mounted on the mounting jaw which cooperates with the force spring for setting a predetermined bias jaw force on the second jaw which is mounted for effecting a rocking motion along an edge of the first jaw so that when the second jaw pivots along the line edge of the first jaw, it forms a plane defining a wedge parallel to the first jaw which is self-aligning.

Self-aligning fine wire clamp

An improved automatic wire feed system for supplying a fine wire to a capillary bonding tool or to a wedge bonding tool is provided. The wire feed system includes a novel wire feed slack loop device which is mounted on the wire bonder between the bonding tool and the source of fine wire. The novel wire feed slack loop device comprises a pair of sector plates which are closely spaced apart from each other to provide an air space therebetween for receiving the fine wire. Compressed air is supplied to the air space between the sector plates and is directed radially outward by a diffuser shim plate which forces the wire to form into a uniform circular shape in the air space. Sensor means are provided at the outer perimeter of the sector plates which sense the position of the fine wire and supplies a signal to control means which turns off the rotation of the drive motor. Turning off the gas provides a slack wire loop with sufficient fine wire to make an interconnection on a semiconductor device without creating tension or compression of the wire at the bonding tool.

Automatic wire feed system

Growing community of inventors

Quakertown, PA, United States of America

Richard Deward Sadler