D-Wave Systems Inc.

Kodak Graphic Communications Canada Company

Creo Products Limited

Richard David Neufeld

Sergey V Uchaykin

Murray C Thom

Gordon J Lamont

Alexander M Tcaciuc

David S Bruce

Jacob Craig Petroff

J Craig Petroff

Paul I Bunyk

Jeremy P Hilton

Calvin Dane Cummings

George E G Sterling

Byong Hyop Oh

Eric G Ladizinsky

Loren J Swenson

Jeffrey P Burress

Allan Warnes

Colin C Enderud

Felix Maibaum

Peter D Spear

Gregory Dean Peregrym

Nicolas C Ladizinsky

Alexandr M Tcaciuc

Jason J Yao

Amar B Kamdar

Edmond Ho Yin Kan

Gregory Citver

Pedro A De Buen

Christopher Earl Trautman

Surjit Singh Dhesi

Systems, methods, and devices for electrically coupling an integrated circuit to a set of coaxial lines via a printed circuit board assembly are described. A device sample holder includes a printed circuit board that is operable to edge-couple to an integrated circuit. A surface of the printed circuit board that carries a set of coaxial connectors is orthogonal to another surface of the printed circuit board that exposes a set of conductive traces. The set of conductive traces are operable to electrically couple to a set of conductive paths of an integrated circuit to provide a communicative path between the integrated circuit and components of an input/output system in a refrigerated environment.

Printed circuit board assembly for edge-coupling to an integrated circuit

A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.

Systems and methods for etching of metals

A multilayer circuit board structure includes superconducting connections to internal layers thereof, for example by inclusion of superconducting vias. Two or more panels can each comprise respective electrically insulative substrates, each have one or more through-holes, and also include a respective bimetal foil on at least a portion of a respective surface thereof, which is patterned to form traces. The bimetal foil includes a first metal that is non-superconductive in a first temperature range and a second metal that is superconductive in the first temperature range. The panels are plated to deposit a third metal on exposed traces of the second metal, the third metal superconductive in the first temperature range. Panels are join (e.g., laminated) to form at least a three-layer superconducting printed circuit board with an inner layer, two outer layers, and superconducting vias between the inner layer and at least one of the two outer layers.

Superconducting printed circuit board related systems, methods, and apparatus

An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.

Method of fabricating an electrical filter for use with superconducting-based computing systems

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

Input/output systems and devices for use with superconducting devices

In one aspect, fabricating a superconductive integrated circuit with a Josephson junction includes applying oxygen or nitrogen to at least part of a structure formed from an outer superconductive layer to passivate an artifact, if any, left from removing the portion of the outer superconductive layer. In another aspect, a first superconductive layer is deposited, a second superconductive layer is deposited on the first superconductive layer, an oxide layer is formed on the first superconductive layer, a dielectric layer is deposited on the oxide layer, a portion of the dielectric layer is removed, a first portion of the oxide layer is removed, a second oxide portion is formed in place of the first portion of the oxide layer, and a third superconductive layer is deposited on the dielectric layer and the second oxide portion.

Systems and methods for fabrication of superconducting circuits

A system may include first and second qubits that cross one another and a first coupler having a perimeter that encompasses at least a part of the portions of the first and second qubits, the first coupler being operable to ferromagnetically or anti-ferromagnetically couple the first and the second qubits together. A multi-layered computer chip may include a first plurality N of qubits laid out in a first metal layer, a second plurality M of qubits laid out at least partially in a second metal layer that cross each of the qubits of the first plurality of qubits, and a first plurality N times M of coupling devices that at least partially encompasses an area where a respective pair of the qubits from the first and the second plurality of qubits cross each other.

Superconducting probe card

Oubit based systems, devices, and methods for analog processing

A method and apparatus for determining the alignment of printing plate mounted on an imaging drum, and applying an image to a printing plate while maintaining registration and alignment between the image and a reference edge of the printing plate include mounting the printing plate on a plate making machine and then determining the locations of at least one point on the reference edge. The locations of two or more points are used to determine a transformation that is applied to image data to yield transformed image data. The transformed image data is used to image the printing plate.

Printing plate registration and optical alignment device including locating at least a part of a reference edge in at least one digital camera image

In accordance with the present invention, the control over a high- speed non-linear actuator is improved by linearizing the relationship between the actuating impetus and the feedback control signal via a method that employs the separate and concurrent control of the static and dynamic characteristics of the device without resorting to the use of force-feedback or field-strength feedback. The resonant frequency of the plunger of the actuator is manipulated during operation such as to maintain it at a substantially fixed optimal value. The method is particularly advantageous in devices where space is at a premium and force-feedback or field-strength feedback mechanisms are difficult to implement.

Method for linearization of an actuator via force gradient modification

Growing community of inventors

Burnaby, Canada

Richard David Neufeld