Funai Electric Company Ltd.

Other

Richard D Wells

Joel P Provence

Jeanne Marie Saldanha Singh

David Christopher Graham

Sean Terrance Weaver

Paul William Dryer

Xiaoming Wu

Anna Marie Pearson

David Bruce Rhine

Jerome F Rock

Joel Provence

A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Photoresist formulation

A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

Spray coatable adhesive for bonding silicon dies to rigid substrates

A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties

A level sensing assembly senses the level of a fluid in a tank. The tank includes a fluid port that is disposed below the level of the fluid and an air port disposed above the level of fluid. The level sensing assembly includes a lower port in fluid communication with the fluid port of the tank. An upper port is in fluid communication with the lower port of the tank. A measuring vessel is disposed between the lower and upper ports and is in fluid communication therebetween. The measuring vessel includes an auxiliary port disposed adjacent the upper port. The level sensing assembly also includes a level sensor extending down through the auxiliary port into the measuring vessel to measure the level of the fluid in the measuring vessel and the level of the fluid in the tank.

Method of modifying a fluid level sensing assembly by replacing a mechanical float

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Westerville, OH, United States of America

Richard D Wells