Gould Inc.

Richard D Patrick

Sidney J Clouser

R Duane Apperson

This invention is directed to an electrodeposited copper foil having a matte-side raw foil R.sub.tm of about 4 to about 10 microns, an ultimate tensile strength measured at 23.degree. C. in the range of about 55,000 to about 80,000 psi, an elongation measured at 23.degree. C. of about 6% to about 25%, an ultimate tensile strength measured at 180.degree. C. in the range of about 30,000 psi to about 40,000 psi, an elongation measured at 180.degree. C. of about 4% to about 15%, and a thermal stability of less than about -20%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) preparing an electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 1.2 to about 4.5 ppm, at least one organic additive at a concentration of about 0.4 to about 20 ppm, and at least one impurity at a concentration of about 0.01 to about 20 grams per liter; (B) flowing said electrolyte solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode, the current density being in the range of about 0.1 to about 3 A/cm.sup.2 ; and (C) removing copper foil from said cathode.

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McConnelsville, OH, United States of America

Richard D Patrick