Microelectronics and Computer Technology Corporation

Other

Smith + Nephew

Teravicta Technologies, Inc.

Dnastar, Inc.

Harris Corporation

Superior Graphite Company

Teravieta Technologies, Inc.

Teravicin Technologies, Inc.

Stovokor Technology LLC

Richard D Nelson

Thomas P Dolbear

Dennis J Herrell

Omkarnath R Gupta

Robert W Froehlich

Chad C Smutney

P Spencer Kinsey

John M Polidoro

Frederick R Blattner

Colin A MacKay

Petter Hedstrom

Michael A Olla

Seyed H Hashemi

Daniel A Nash

Schuyler F Baldwin

Timothy J Morrill

Kenneth C Dullea

Anjan Somadder

Timothy J Durfee

Gregory Melville

David A Gibson

Claude Hilbert

Calvin Lee Adkins

Thomas Alan Bishop

Ernest R Nolan

Chung J Lee

Changjun Zhou

Mark R Breen

Michael Alan Gribbons

Randy L German

Kimcuc T Tran

William Gregory Flynn

Diana C Duane

Jason Reed

David A Goins

David John Tammen

Kathryn V Keswick

Todd H Herder

Systems and methods automatically identify a set of read sequences in one or more larger nucleotide sequences within a set of comparing sequences as a template. The sequences of each set are divided into smaller mer sequences and sorted to arrange the mer sequences in order, and the sets of mers originating from the read sequence set and the comparing sequence set are compared pairwise to determine matching regions between the sequences of the read sequence set and the sequences of the comparing set. The sorting of the sequence sets prior to the pairwise comparison reduces the amount of volatile memory required to assemble the read sequence set and also reduces the overall time to identify matches of the read sequence set in one or more larger nucleotide sequence databases.

Systems and methods for identifying nucleotide sequence matches

A carbonaceous particulate material is provided that is characterized by having a reversible volumetric expansion/contraction in fluid media ('V') of greater than or equal to (&#x2267;)3% between 4,000 psi and 10,000 psi. The porous carbonaceous particulate material of the present disclosure is also characterized by having a true density, ('P'), of 1.2 g/cc&#x2266;P&#x2266;2.0 g/cc, when milled to &#x2212;200 mesh and has a dparticle size distribution of about 15 &#x3bc;m. This is the consequence of the instant material exhibiting a high level of closed porosity with very small pores, in contrast with prior art materials that would have a wider range pore sizes for the closed pores.

Compressible carbonaceous particulate material and method of making same

Systems and methods automatically assemble a set of read sequences into one or more larger nucleotide sequences using a set of comparing sequences as a template. The sequences of each set are divided into smaller mer sequences and sorted to arrange the mer sequences in order, and the sets of mers originating from the read sequence set and the comparing sequence set are compared pairwise to determine matching regions between the sequences of the read sequence set and the sequences of the comparing set. The sorting of the sequence sets prior to the pairwise comparison reduces the amount of volatile memory required to assemble the read sequence set and also reduces the overall time to assemble the read sequence set into one or more larger nucleotide sequences.

System for assembling a derived nucleotide sequence

A fluid conduit connector assembly includes a connector having a body with an inner surface defining a fluid channel. The connector also includes an inlet region for flow of fluid into the fluid channel, and an outlet region for flow of fluid from the fluid channel. The connector further includes an axial alignment member outward of the body, and a pair of flexible tabs arranged generally circumferentially of the alignment member and outward of the body. The connector can be configured as a day-side connector, transfer member with check valve, and/or patient-side connector. An implementation includes a day-side connector, a patient-side connector, and a transfer member, each of which has a pair of flexible tabs. The pairs of tabs are configured such that the transfer member releasably couples the day-side and patient-side connectors. A method for aseptically connecting a fluid conduit is also disclosed.

Fluid conduit connection

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

Integrated cooling system

A microelectromechanical system (MEMS) switch is provided which includes a multiple of three support arms extending from the periphery of a moveable electrode. In addition, MEMS switch includes a plurality of contact structures having portions extending into a space between a fixed electrode and the moveable electrode. In some cases, the relative arrangement of the support arms and the contact structures are congruent among three regions of the MEMS switch which collectively comprise the entirety of the fixed electrode and the entirety of the moveable electrode. In other embodiments, the contact structures may not be arranged congruently within the MEMS switch.

Plate-based microelectromechanical switch having a three-fold relative arrangement of contact structures and support arms

A microelectromechanical device is provided which includes a beam configured to apply an opening force on a closed switch. The opening force may be substantially independent of a force stored in the closed switch. A combination of the force applied by the beam and the force stored in the closed switch may be sufficient to open the switch after removal of a force associated with actuation of the switch. Another microelectromechanical device includes a switch beam spaced above a closing gate and a contact structure. The device may also include an additional beam configured to apply a force on the switch beam in a direction away from the contact structure. A method for opening a switch includes reducing an attractive force between a switch beam and a closing gate. The method also includes externally applying a mechanical force on the switch beam in a direction away from the closing gate.

Microelectromechanical device having an active opening switch

A microelectromechanical device is provided which includes a contact structure interposed between a pair of electrodes arranged beneath a beam. In some embodiments, the device may include additional contact structures interposed between the pair of electrodes. For example, the device may include at least three contact structures between the pair of electrodes. In some embodiments, the beam may be suspended above the pair of electrodes by a support structure affixed to a first end of the beam. Such a device may further include an additional support structure affixed to a second end of the beam. In some cases, the device may be adapted to pass a signal from the first end to the second end of the beam. In addition or alternatively, the device may be adapted to pass the signal between one or both ends of the beam and one or more of the contact structures.

Device having one or more contact structures interposed between a pair of electrodes

A device is provided which is adapted to electrostatically pull a cantilever away from a conductive pad. In particular, a microelectromechanical device is provided which includes a fulcrum contact structure interposed between two electrodes spaced under a cantilever and a conductive pad arranged laterally adjacent to one of the electrodes. The cantilever may be brought into contact with the conductive pad by residual forces within the cantilever and/or an application of a closing voltage to one of the electrodes. Such a device may be adapted bring the cantilever in contact with the fulcrum contact structure by applying an actuation voltage to the other of the electrodes. In addition, the actuation voltage may deflect the cantilever away from the conductive pad. In some cases, deflecting the cantilever from the conductive pad may include releasing the closing voltage and increasing the actuation voltage subsequent to the release of the closing voltage.

Device adapted to pull a cantilever away from a contact structure

An electronic device, such as a filter or phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor preferably includes a lower capacitor electrode on the substrate, and a movable bridge including end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. The upper and lower positions provide respective low and high selectable capacitance values. Moreover, the movable bridge may further include at least one travel limiting portion between the end portions for engaging adjacent substrate portions to keep the upper capacitor electrode in a predetermined spaced relation from the lower capacitor electrode when in the lower position. This travel limiting feature of the MEMS capacitor is relatively easy to fabricate and avoids the sticking or stiction problem of some other types of MEMS capacitors.

Electronic device including multiple capacitance value MEMS capacitor and associated methods

Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.

Compliant electrically connective bumps for an adhesive flip chip

A method of providing a thermally conductive connection between spaced surfaces includes (a) mixing a thermally conductive filler containing a liquid metal into an unhardened matrix material, and (b) contacting the unhardened matrix material and randomly dispersed, separate spaced non-solidified regions of filler within the unhardened matrix material to the surfaces. A solid mechanical bond may be provided by hardening the matrix material or by providing a separate adhesive between the surfaces. Preferably, the regions of filler form separate spaced continuous thermally and electrically conductive paths between the surfaces.

Thermally conductive connection with matrix material and randomly

A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.

Method for encapsulating an integrated circuit using a removable

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Austin, TX, United States of America

Richard D Nelson