International Business Machines Corporation

Richard D Musa

Mohanlal Savji Mansuria

Joseph M Mosley

Vito J Tuozzolo

Brian Alan Trumbo

Michael Sven Miller

William Frederick Shutler

Jeffrey W Benck

This invention relates to personal computers in which provision is made for effective cooling of components capable of generating significant heat during operation, such as certain high performance microprocessors. The personal computer has an enclosure for enclosing operating components, a printed circuit board mounted within the enclosure for supporting and interconnecting operating components of the personal computer, heat generating components mounted on the printed circuit board for performing operating functions for the personal computer, a fan for inducing air to flow into the enclosure, a fan for expelling air from the enclosure, and an air flow directing baffle mounted within the enclosure in the path of air flow from one fan toward the other fan and adjacent the heat generating components for directing the flow of air through the enclosure to pass over and cool the heat generating components.

Personal computer with tandem air flow dual fans and baffle directed air

A thermoelectrically cooled integrated circuit package including an insulative module which defines a cavity, a thermoelectric cooler within the cavity, and an integrated circuit chip connected to the thermoelectric cooler, thus providing an integrated circuit package in which the integrated circuit package itself dissipates thermal energy generated by the integrated circuit chip.

Integrated thermoelectric cooling

A thermoelectrically cooled integrated circuit package is provided which includes a thermally conductive dielectric substrate, an input connecting portion and an output connecting portion supported by the dielectric substrate, and an integrated circuit chip including an input terminal and output terminal. The input terminal is electrically connected to the input connecting portion via a first conductive material, and the output terminal is electrically connected to the output connecting portion via a second conductive material. The first conductive material and the second conductive material thermoelectrically cool the integrated circuit chip when a signal passes through the first conductive material and the second conductive material.

Thermoelectric cooling via electrical connections

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Boca Raton, FL, United States of America

Richard D Musa