K2 Optronics, Inc.

Emcore Corporation

Richard D Bjorn

John Cameron Major

Frans Kusnadi

Zequn Mei

Robert A Clarke

Zequin Mei

Vadim Chuyanov

An electrical resistor structure overlies a substrate and comprises a composite resistor having a first resistor of relatively low resistance and a second resistor of relatively high resistance overlying the first resistor. First and second electrodes make contact with the composite resistor at spaced locations, and a bond pad overlies the second resistor at a position between the electrodes. A metallized fiber is soldered a to a metal bond pad by providing a stacked resistor structure beneath the bond pad, disposing a solder preform over the bond pad, disposing the metallized fiber over the bond pad, and flowing a current through the stacked resistor structure. The stacked resistor structure, when subjected to a current flowing generally along a first axis, is characterized by a temperature profile that has first and second peaks on either side of the bond pad. The fiber is disposed along a second axis in the region of the bond pad where the second axis is at a non-zero angle (possibly, but not necessarily a right angle) with respect to the first axis.

Stacked electrical resistor pad for optical fiber attachment

A substrate structure useful for photonics modules comprises a high-thermal-conductivity (e.g., greater than 20 W/m&#xb0;K) substrate body with a low-thermal-conductivity (e.g., less than 5 W/m&#xb0;K) dielectric layer overlying at least a portion of the substrate body. Patterned metal layers for electrical circuit connections can be located on the dielectric layer, on the substrate body (under the dielectric layer, on regions of exposed substrate body, or both), or on both. Where the laser is driven at high frequencies (e.g., 2.5 Gbits/sec), the dielectric layer material and thickness can be chosen to provide desired RF behavior. For example, the electrodes and dielectric layer can be configured to provide a transmission line with the desired impedance. Further, where it is desired to solder a component to the substrate, a heater resistor can be formed on the dielectric layer, thereby facilitating soldering the component.

Substrate structure for photonic assemblies and the like having a low-thermal-conductivity dielectric layer on a high-thermal-conductivity substrate body

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Milpitas, CA, United States of America

Richard D Bjorn