Applied Materials, Inc.

B/e Aerospace, Inc.

Advanced Thermal Sciences Corporation

Other

Alten, LLC

Richard Charles Fovell

James D Carducci

Douglas A Buchberger, Jr

Paul Brillhart

Daniel John Hoffman

Kallol Bera

Douglas H Burns

Kartik Ramaswamy

Kenneth S Collins

Hamid Tavassoli

Shahid Rauf

Kenneth Wesley Cowans

Glenn Zubillaga

Jason Andrew Kenney

William W Cowans

Isaac Millan

Philip Allan Kraus

James P Cruse

Ezra Robert Gold

Larry D Elizaga

Thai Cheng Chua

Silverst Rodrigues

Ajit Balakrishna

Chunlei Zhang

Jared Ahmad Lee

Andrew Nguyen

Leonid Dorf

Ankur Agarwal

Martin Jeffrey Salinas

Douglas Buchberger

Bruno Geoffrion

Yang Yang

Joseph F AuBuchon

Steven Lane

Vladimir Knyazik

Lawrence Wong

Fernando Silveira

Michael Robert Rice

Vijay D Parkhe

Bryan Y Pu

Anisul Haque Khan

Paul E Luscher

Evans Yip Lee

Yan Rozenzon

Shane C Nevil

Karthikeyan Balaraman

Jivko Dinev

Sathya Swaroop Ganta

Kaushik Vaidya

Sang In Yi

Dong Ho Choi

Klaus W Heinemann

Gil Lavi

Matt Hamrah

Isaac Millian

Jared Ahmed Lee

Williams W Cowans

Jan M Heinemann

Robert Moore

Methods and apparatus of controlling a temperature of components in a process chamber that is heated by a plasma or a heater and cooled by a coolant flow through a heat exchanger. An apparatus, for example, can include a chuck assembly and/or a plasma source including a respective cooling plate; a proportional bypass valve connected between the respective cooling plate and a heat exchanger; a temperature sensor configured to measure a temperature of the coolant through the outlet channel of the respective cooling plate; and a controller that receives a measured temperature from the temperature sensor measuring, and in response to receiving the measured temperature controls a rate of flow of the coolant through the first coolant output line and the second coolant output line of the proportional bypass valve.

Methods and apparatus for processing a substrate

Embodiments disclosed herein include a housing for a source array. In an embodiment, the housing comprises a conductive body, where the conductive body comprises a first surface and a second surface opposite from the first surface. In an embodiment a plurality of openings are formed through the conductive body and a channel is disposed into the second surface of the conductive body. In an embodiment, a cover is over the channel, and the cover comprises first holes that pass through a thickness of the cover. In an embodiment, the housing further comprises a second hole through a thickness of the conductive body. In an embodiment, the second hole intersects with the channel.

Monolithic modular microwave source with integrated process gas distribution

Embodiments disclosed herein include a housing for a source assembly. In an embodiment, the housing comprises a conductive body with a first surface and a second surface opposite from the first surface, and a plurality of openings through a thickness of the conductive body between the first surface and the second surface. In an embodiment, the housing further comprises a channel into the first surface of the conductive body, and a cover over the channel. In an embodiment, a first stem over the cover extends away from the first surface, and a second stem over the cover extends away from the first surface. In an embodiment, the first stem and the second stem open into the channel.

Monolithic modular microwave source with integrated temperature control

Embodiments disclosed herein include a modular microwave source array. In an embodiment, a housing assembly for the source array comprises a first conductive layer, wherein the first conductive layer comprises a first coefficient of thermal expansion (CTE), and a second conductive layer over the first conductive layer, wherein the second conductive layer comprises a second CTE that is different than the first CTE. In an embodiment, the housing assembly further comprises a plurality of openings through the housing assembly, where each opening passes through the first conductive layer and the second conductive layer.

Modular microwave source with multiple metal housings

A coil assembly for controlling a magnetic field in a plasma chamber is provided herein. In some embodiments, the coil assembly may include a mandrel including an annular body that includes at least one upper body coolant channel and at least one lower body coolant channel, and a plurality of cooling fins disposed circumferentially about an outer diameter of the body and radially outward from the outer diameter, an inner electromagnetic cosine-theta (cos θ) coil ring including a first set of inner coils wrapped around the plurality of cooling fins in the body and configured to generate a magnetic field in a first direction, an outer electromagnetic cosine-theta (cos θ) coil ring including a second set of outer coils wrapped around the plurality of cooling fins and configured to generate a magnetic field in a second direction orthogonal to the first direction.

Two channel cosine-theta coil assembly

Embodiments disclosed herein include a source for a processing tool. In an embodiment, the source comprises a dielectric plate having a first surface and a second surface opposite from the first surface, and a cavity into the first surface of the dielectric plate. In an embodiment, the cavity comprises a third surface that is between the first surface and the second surface. In an embodiment, the source further comprises a dielectric resonator extending away from the third surface.

Modular microwave source with embedded ground surface

A gas distribution plate assembly for a processing chamber is provided that in one embodiment includes a body made of a metallic material, a base plate comprising a silicon infiltrated metal matrix composite coupled to the body, and a perforated faceplate comprising a silicon disk coupled to the base plate by a bond layer.

Gas distribution plate assembly for high power plasma etch processes

A plasma reactor has an overhead inductively coupled plasma source with two coil antennas and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.

Symmetrical plural-coil plasma source with side RF feeds and RF distribution plates

Apparatus for controlling thermal uniformity of a substrate-facing surface of a showerhead are provided herein. In some embodiments, a heat transfer system includes a heat transfer plate having a first diameter and a plurality of independent flow paths disposed within the heat transfer plate, each flow path having a first inlet and a first outlet; a supply conduit system having a second inlet fluidly coupled to a plurality of second outlets, wherein each second outlet is fluidly coupled to a corresponding first inlet of the heat transfer plate; and a return conduit system having a third outlet fluidly coupled to a plurality of third inlets, wherein each third inlet is fluidly coupled to a corresponding first outlet of the heat transfer plate, wherein the supply conduit system and the return conduit system are each disposed within an imaginary cylindrical projection above the heat transfer plate.

Apparatus for controlling temperature uniformity of a showerhead

Embodiments of the invention include an apparatus, system, and method for cooling a pedestal for supporting a workpiece during plasma processing. An embodiment of a pedestal includes: a base over which the workpiece is to be disposed, a plurality of nozzles to supply a fluid from a supply plenum to impinge on a surface of the base, and a plurality of return conduits to return the supplied fluid to a return plenum. The fluid to be supplied by the plurality of nozzles can be projected as one or more jets submerged in surrounding fluid or as a spray that emerges from a surrounding fluid within a volume between the plurality of nozzles and the base to impinge on the surface of the base.

Distributed electro-static chuck cooling

Plural sensors on an interior surface of a reactor chamber are linked by respective RF communication channels to a hub inside the reactor chamber, which in turn is linked to a process controller outside of the chamber.

Method of real time in-situ chamber condition monitoring using sensors and RF communication

A plasma reactor has an overhead multiple coil inductive plasma source with symmetric RF feeds and symmetrical RF shielding around the symmetric RF feeds.

Symmetrical inductively coupled plasma source with coaxial RF feed and coaxial shielding

Growing community of inventors

San Jose, CA, United States of America

Richard Charles Fovell