The Boeing Company

Richard Charles Barclay

Kay Youngdahl Blohowiak

Mark Richard Brei

Anthony M Westren

Ashley C Tracey

Tara Kovacs Baker

Tyler Jacob Zimmerman

Yuliya Shafranyuk

Philip Lawrence Freeman

Trent T Weiss

Optimized-coverage selective laser ablation systems and methods may be utilized to prepare (ablate) a three-dimensional surface. Methods comprise receiving a 3D virtual model of the surface to be ablated, generating a preliminary ablation path, and optimizing the preliminary ablation path to produce an adapted ablation path. Methods may comprise ablating the surface according to the adapted ablation path. The preliminary ablation path may be based on scanning a laser sheet across a two-dimensional projection of the surface. The optimization may adjust one or more waypoints of the preliminary ablation path to achieve complete coverage of the surface at acceptable levels of ablation, with little to no ablation outside the surface, and with acceptable (e.g., at least locally minimal) time to ablate the surface.

Optimized-coverage selective laser ablation systems and methods

Provided are molds, comprising non-metal base portions and protective optical layers that cover and shield these base portions from laser ablation. For example, a protective optical layer may reflect a laser beam used for ablating the mold. Methods of forming these protective optical layers on non-metal base portions are also provided. In some embodiments, this protective optical layer is the outermost layer exposed to the environment. Alternatively, the protective optical layer may be covered by a release layer. The release layer may be retained or removed during laser ablation. In some embodiments, light emitted by a mold during laser ablation is analyzed to determine performance of its protective optical layer. This feedback may be used to control the laser ablation such as to control orientation of the laser beam relative to the mold.

Processing tool cleaning using laser ablation

A laser ablation system comprises a laser, a scanning head, a laser-positioning apparatus, and a controller. The laser is configured to emit a laser beam. The scanning head is configured to deliver the laser beam onto a surface. The laser-positioning apparatus is configured to adjust relative positions of the surface and the scanning head. The controller is programmed to determine operation parameters such as a traverse scan speed, a laser-beam average power, a laser pulse repetition rate, a laser pulse width, and a laser-beam spot area for each one of scan regions of an area of the surface. The scan regions are arranged so that all of the area of the surface is scannable with the laser beam. The scan width of at least one of the scan regions is different from the scan width of another one of the scan regions.

Large-area selective ablation systems

A method of using a laser ablation system to clean an area of a surface with a laser beam, having a target fluence and a target irradiance. The area comprises scan regions, each having a scan width. The method comprises determining a traverse scan speed, a laser-beam average power, a laser pulse repetition rate, a laser pulse width, and a laser-beam spot area of the laser beam for each one of the scan regions to achieve the target fluence and the target irradiance. The scan width of at least one of the scan regions is different from the scan width of another one of the scan regions. The method also comprises sequentially scanning, across the scan width, each one of the scan regions of the area with the laser beam at the target fluence and the target irradiance.

Large-area selective ablation methods

Provided are methods for cleaning processing tools from residue using laser ablation. Also provided are processing tools comprising non-metal base portions and protective optical layers that cover and shield these base portions from laser ablation. For example, a protective optical layer may reflect a laser beam used for ablating the tool. Methods of forming these protective optical layers on non-metal base portions are also provided. In some embodiments, this protective optical layer is the outermost layer exposed to the environment. Alternatively, the protective optical layer may be covered by a release layer. The release layer may be retained or removed during laser ablation. In some embodiments, light emitted by a processing tool during laser ablation is analyzed to determine performance of its protective optical layer. This feedback may be used to control the laser ablation such as to control orientation of the laser beam relative to the processing tool.

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Ladson, SC, United States of America

Richard Charles Barclay