Augat Inc.

Richard C Holt

Neil F Damon

Richard J Hanlon

A method for producing a wired circuit board is disclosed in which a wire mat is first formed on a fixture and then mated with a circuit board having a specified conductive pad layout on the board surface. A continuous wire is routed on a fixture along a predetermined path over a thermoplastic adhesive layer and the wire is adhered to the layer to fixably position the wire in the routed configuration. The continuous wire is severed at selected locations to form a plurality of wire nets. A wire mat thus formed is mated with a circuit board having conductive pads disposed on the board surface such that selected points of selected wires confront selected conductive pads on the circuit board. Compressive pressure is applied to the wire mat and circuit board to conformally adhere the wire mat to the circuit board. The circuit board and wire mat adhered thereto are next heated at elevated temperature to cure the adhesive layer. Selected points of wires confronting conductive pads on the circuit board are then soldered to the respective pads to complete interconnection of predetermined conductive pads on the circuit board thereby yielding a wired circuit board adapted to receive integrated circuit and other electrical components. A wire mat produced in the disclosed manner may be applied to one or both circuit board surfaces.

Wire mat mateable with a circuit board

A method for producing a wired circuit board is disclosed in which a wire mat is formed on a fixture and then mated with a circuit board having a specified conductive pad layout on the board surface. A continuous wire is routed on a fixture along a predetermined path over a thermoplastic adhesive layer and the wire is adhered to the layer to fixably position the wire in the routed configuration. The continuous wire is severed at selected locations to form a plurality of wire nets. A wire mat thus formed is mated with a circuit board having conductive pads disposed on the board surface such that selected points of selected wires confront selected conductive pads on the circuit board. Compressive pressure is applied to the wire mat and circuit board to conformally adhere the wire mat to the circuit board. The circuit board and wire mat adhered thereto are next heated at elevated temperature to cure the adhesive layer. Selected points of wires confronting conductive pads on the circuit board are then soldered to the respective pads to complete interconnection of predetermined conductive pads on the circuit board thereby yielding a wired circuit board adapted to receive integrated circuit and other electrical components. A wire mat produced in the disclosed manner may be applied to one or both circuit board surfaces. In another embodiment of the invention the continuous wire is severed after mating the wire mat to the circuit board and curing the adhesive layer.

Method of producing a wired circuit board

A printed circuit board, and method for its fabrication, wherein a first side of the board includes a network of interconnection wires channeled generally in groups along pathways apart from the region for the installation of electrical components and the board apertures through which their associated leads pass. The network of wires is encapsulated below a plastic sheet adhered to the surface of the circuit board after wiring. The electrical components are subsequently installed from the same side as the network of wiring and are electrically connected into the wiring network by wave soldering applied to the opposite board surface. Such a printed circuit board permits the doubly efficient use of automated interconnect wiring in combination with component installation by wave soldering. The network of wiring is typically adhered to the surface by a layer of sheet adhesive applied under elevated temperature and pressure. The adhering of the interconnect network keeps individual wires from interfering with the installation of circuit components and makes possible the location of both components and interconnect wiring on the same circuit board side. This in turn frees the opposite side for mass installation techniques such as wave soldering.

Process for interconnecting components on a PCB

An electrical interconnection board with lead sockets mounted in plated-through holes therein. The lead sockets are hollow cylindrical elements having a tapered entry opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the plated-through holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.

Electrical interconnection boards with lead sockets mounted therein and

An electrical interconnection board with lead sockets mounted in holes therein. The lead sockets are hollow cylindrical elements having a tapered opening at one end and a plurality of normally converging flexible fingers at the other end. The lead sockets are force fitted into the holes in the board with the receptacle end of the socket opening into the component side of the board. The invention is also concerned with the method for mounting lead sockets to electrical interconnection boards.

Growing community of inventors

Fairhaven, MA, United States of America

Richard C Holt