Hewlett-Packard Development Company, L.p.

Hewlett Packard Enterprise Development LP

Richard Bargerhuff

John P Franz

David A Selvidge

Sunil Rao Ganta Papa Rao Bala

Carl D Massey

Shailesh N Joshi

Erik Robert Nielsen

Nabeel Fathi

Jeff Giardina

A flexible heat transfer mechanism is provided for transferring heat from a heat generating component to a heatsink. The heat transfer mechanism may include a pedestal coupled to the heatsink via a heat transfer element. The heat transfer element may be a compliant member that is capable of flexing in a vertical direction such that the pedestal may be vertically displaced relative to the heatsink.

Flexible heat transfer mechanism configurations

In one embodiment an enclosure for a high-density storage system, comprises a backplane to which a plurality of data storage devices may be coupled, a front panel opposite the backplane and defining a first airflow channel adjacent a front side of the data storage devices, a back panel opposite the front panel and comprising a second airflow channel adjacent the backplane, a floor panel and a top panel, a first side panel comprising an array of air flow inlets, a second side panel comprising at least one air flow outlet, and a fan assembly to expel air from the at least one air outlet.

Cooling in high-density storage systems

A heatsink includes a plurality of fans mounted to the heatsink. The plurality of fans includes a first fan that provides an airflow for the heatsink and a second fan that selectively modifies the airflow.

Heatsink with a plurality of fans

A baffle manages airflow through optionally mounted electronic components by using flexible members formed to extend to empty connectors and flex away from the connectors to accommodate electronic components mounted to the connectors.

Growing community of inventors

Houston, TX, United States of America

Richard Bargerhuff