Osram Oled Gmbh

Pictiva Displays International Limited

Osram Opto Semiconductors Gmbh

Richard Baisl

Erwin Lang

Michael Popp

Tilman Schlenker

Dominik Pentlehner

Christoph Kefes

Marc Philippens

Johannes Rosenberger

Philipp Schwamb

Evelyn Trummer-Sailer

Doreen Heppner

Thomas Wehlus

Nina Riegel

Arne Fleissner

Simon Schicktanz

Benjamin Krummacher

Andreas Rausch

Daniel Riedel

Andrew Ingle

Arndt Jaeger

Thomas Dobbertin

Silke Scharner

Dirk Becker

Christian Schmid

Gudrun Lindberg

Klaus Müller

An optoelectronic assembly comprising an optoelectronic component, which comprises a specularly reflective surface and comprising a radiation cooler in direct physical contact with the optoelectronic component. The radiation cooler is arranged above the specularly reflective surface.

Optoelectronic assembly and method for producing an optoelectronic assembly

A method for producing an organic electronic device is disclosed. In an embodiment the method includes applying an organic material to a substrate to form at least one organic functional layer, applying a patterned electrode material to the at least one organic functional layer by a first mask, and removing the organic material from regions which are free of the electrode material.

Method for producing an organic electronic device

An optoelectronic component is provided with a carrier; a zinc oxide layer arranged on the carrier and having the first and second regions, wherein the first region is a first electrode structure which is doped with aluminum so that the first region is transparent and electrically conductive; an organic optically functional layer structure arranged at least partially over the first electrode structure; and a second electrode structure arranged at least partially over the organic optically functional layer structure. The first and second electrode structures electrically contact the organic optically functional layer structure. The zinc oxide layer has a lower doping in the second region than the first electrode structure. The zinc oxide layer is configured in the second region as a varistor layer structure, which is arranged between the first and second electrode structures and contacts the two electrode structures. The varistor layer structure adjoins the optically transparent first region.

Optoelectronic component and method for producing an optoelectronic component

A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Light-emitting component and method for producing a light-emitting component

An optoelectronic component may include a carrier, a first electrode over the carrier, an organically functional layer structure over the first electrode, a second electrode over the organically functional layer structure, and an encapsulation layer structure over the second electrode, the encapsulation layer structure encapsulating the organically functional layer structure and including a first layer structure facing toward the second electrode and a second layer structure facing away from the second electrode, the first layer structure alternately including first layers having a first expansion coefficient and second layers having a second expansion coefficient, which is not equal to the first expansion coefficient, and the second layer structure alternately including third layers having a third expansion coefficient and fourth layers having a fourth expansion coefficient, which is not equal to the third expansion coefficient.

Optoelectronic component with multilayer encapsulant CTE matched to electrode

The invention relates to an organic optoelectronic component comprising a substrate () on which a first electrode (), then an organic functional layer stack () having at least one organic optoelectronic layer, and then a second electrode () are successively arranged. A thin film encapsulation () is arranged over the second electrode () and in addition to the second electrode (), at least one first intermediate layer () having a hardness which is different from the layer which is directly adjacent thereto is arranged between the organic functional layer stack () and the thin-film encapsulation ().

Organic optoelectronic component

An element () is provided for stabilising an optoelectronic device (), wherein the element () comprises a main body (C), wherein the main body (C) consists of a glass or at least comprises a glass and wherein the main body (C) comprises a first and a second surface (A,B). The first and second surface (A,B) are opposite to one another and extend in each case in a lateral main direction of extension of the element (), wherein a protective layer (A,B) is formed at least at one of the surfaces (A,B) and wherein the protective layer (A,B) is configured and arranged in such a way that cracks () present in the main body (C) are filled in by a material of the protective layer (A,B). In addition, an optoelectronic device () is provided.

Element for stabilizing an optoelectronic device method for producing an element and optoelectronic device

In various embodiments, an organic optoelectronic component is provided. The organic optoelectronic component may include a first electrode, an organic functional layer structure over the first electrode, and a second electrode over the organic functional layer structure. Optionally, the organic functional layer structure includes a charge carrier pair generation layer structure. At least one of the electrodes and/or the charge carrier pair generation layer structure includes electrically conductive nanostructures, the surfaces of which are at least partially coated with a coating material.

Organic optoelectronic component and method for producing an organic optoelectronic component

A method for producing an optoelectronic component may include forming an optoelectronic layer structure having a first adhesion layer, which comprises a first metallic material, above a carrier, providing a covering body with a second adhesion layer, which comprises a second metallic material, applying a first alloy to one of the two adhesion layers, the melting point of the first alloy being so low that the first alloy is liquid, coupling the covering body to the optoelectronic layer structure in such a way that both adhesion layers are in direct contact with the liquid first alloy, and reacting at least part of the liquid first alloy chemically with the metallic materials, as a result of which at least one second alloy is formed, which has a higher melting point than the first alloy, wherein the second alloy solidifies and fixedly connects the covering body to the optoelectronic layer structure.

Optoelectronic component and method for producing same

An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on a translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement, and the thin-film encapsulation arrangement is arranged directly on the translucent protective layer.

Organic light-emitting element and method of producing an organic light-emitting element

An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Encapsulation for an organic electronic device

A method for producing an optoelectronic component includes forming an optoelectronic layer structure including a functional layer structure above a carrier, forming a frame structure including a first metallic material on the optoelectronic layer structure such that a region above the functional layer structure is free of the frame structure and that the frame structure surrounds the region, forming an adhesion layer including a second metallic material above a covering body, applying a liquid first alloy to the optoelectronic layer structure and/or to the adhesion layer of the covering body in the region, coupling the covering body to the optoelectronic layer structure such that the adhesion layer is coupled to the frame structure and the liquid first alloy is in direct contact with the adhesion layer and the frame structure, and reacting part of the first alloy chemically with the metallic materials of the frame structure and the adhesion layer.

Optoelectronic component and method for the production thereof

An organic light-emitting component includes a substrate on which a functional layer stack is applied, the stack including a first electrode, an organic functional layer stack thereover including an organic light-emitting layer and a translucent second electrode thereover, and a translucent halogen-containing thin-film encapsulation arrangement over the translucent second electrode, wherein a translucent protective layer having a refractive index of more than 1.6 is arranged directly on the translucent second electrode between the translucent second electrode and the thin-film encapsulation arrangement.

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Wuppertal, Germany

Richard Baisl