Cray Research, Inc.

Silicon Graphics, Incorporated

Silicon Graphics International Corporation

Richard B Salmonson

Stephen A Bowen

Stephen Cermak, Iii

David Paul Gruber

Steven J Dean

Mark Ronald Sikkink

Daniel J Dravis

Russell Eric Stacy

Roger Ramseier

Max C Logan

Robert J Lutz

Mark Maloney

Richard G Finstad

Scott Louis Robinson

Robert J Greener

A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.

On-blade cold sink for high-density clustered computer system

A system and method of reducing back flow in an air mover having one or more blades is described. A flap is attached to a blade of the air mover such that, when back flow occurs, the flap obscures all or a portion of the space between blades during back flow.

System and method for reducing back flow

Assembly process and heat sink design for high powerd processor

An air cooled computer assembly including a printed circuit board assembly or a U sized enclosure. The computer assembly also includes three 120 mm fans positioned at one end of the PCB assembly providing air flow across the PCB assembly. The printed circuit board assembly has a top side and a bottom side, including heat producing components on the top side and bottom side. A portion of the heat producing components are DIMM memory positioned perpendicular to the direction of air flow. The computer assembly also includes an air baffling system positioned proximate to the PCB assembly. The air baffling system divides and balances the air flow between the heat producing components so that each of the components are adequately cooled. The air baffling system includes a flat baffle and pair of curved baffles. The flat baffle is positioned perpendicular to the direction of the air flow and is positioned between and in front of two 40 watt memory. The curved baffles are positioned adjacent to the two memory ASICs. One curved baffle is positioned between one memory ASIC and the outside of the PCB assembly and the other curved baffle is positioned between the other memory ASIC and the opposite side of the PCB assembly. The curved baffles include a curved portion, an extended portion and a front portion. The heat producing components include memory DIMMS, 4 130 watt microprocessors, and two 40 watt memory ASICs.

Baffle system for air cooled computer assembly

Heat sink attachment clip

A cold plate that provides air or liquid cooling for a computer circuit module and has at least one mounting plate with a board mounting surface on one side for carrying a printed circuit board assembly and a cooling surface located on the other side. A cover is disposed parallel to and spaced apart from the mounting plate with a cooling chamber defined between the two. The cooling chamber is divided into a liquid cooled section and an air cooled section. The liquid cooled section has a coolant inlet and outlet and flow channels for directing coolant through the liquid cooled section from inlet to outlet. The air cooled section has an air inlet and outlet and flow channels for directing air through the air cooled section from inlet to outlet. The cold plate is adapted so that it may be installed into a circuit module and provide either liquid cooling or air cooling for the module.

Air or liquid cooled computer module cold plate

The present invention discloses a method and apparatus for bridging the gap between an integrated circuit package or component mounted on a circuit board and a heat sink such that there is little stress placed on the component, but there is still a connection between the component and the heat sink for dissipation of heat. The invention provides mechanical integrity for delicate component packages, and in doing so allows for the use of a variety of heat sinks to provide cooling. A printed circuit board has integrated circuit packages or other components mounted to the circuit board. A cooling cap comprised of a thermally conductive material is mounted on the circuit board, such that the component is enveloped by the circuit board and cooling cap. A layer of thermally conductive material may be deposited between the component and the cooling cap to provide a thermally conductive path from the component to the cooling cap. Risers, which may be either integral to the cooling cap or separate elements, are used to lift the cooling cap above the surface of the circuit board so as to provide space for the component.

Cooling cap method and apparatus for tab packaged integrated circuit

Cooling cap method and apparatus for tab packaged integrated circuits

A method and apparatus for conductively cooling daughter card assemblies mounted to either an air or liquid cooled computer circuit module wherein the module has a cold plate and at least one mother board adjacent the cold plate. The module carries a number of daughter assemblies thereon adjacent the mother board. Each daughter card assembly has at least one daughter board which carries a number of electronic components on an element side of the board. A cooling side is disposed opposite the element side on the board. A thermally conductive plate has an inner side facing the mother board and an outer side opposite the inner side. The inner side has one or more projecting members extending perpendicularly towards the mother board. The daughter board is parallel to and in conductive contact with one side of the conductive plate. The module cold plate has a number of upstanding spacers projecting toward the mother board. A portion of the top of each spacer is exposed for receiving thereon one of the projecting members of the conductive plate in intimate conductive contact. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards. Heat generated by the electronic components on the daughter boards is transferred by conduction through the boards into the conductive plate. The heat conducts through the projecting members into the spacers and into the module cold plate. The heat is then carried away by the cooling medium flowing through the cold plate.

Method and apparatus for cooling daughter card modules

A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.

Cooling approach for high power integrated circuits mounted on printed

A daughter card assembly which provides relatively high conductive heat transfer from the electronic components on the daughter board to either an air or liquid cooled cold plate of a computer circuit module. The daughter card assembly has a daughter board with a plurality of electronic elements carried on an element side of the board. The opposite side of the board is a cooling side. The daughter board has one or more sockets which are electrically connected to the electronic elements on the board. The socket is adapted to plug into a connector carried on a mother board of a circuit module. A thermally conductive plate is disposed adjacent to and in thermal conductive contact with the cooling side of the daughter board. The conductive plate has an inner side facing the circuit module and an outer side on the opposite side. The plate is adapted to be in thermal conductive contact with the module cold plate to dissipate heat generated by the memory elements. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards with one board abutting against the inner side and the other board abutting against the outer side of the plate.

Daughter card assembly

An apparatus and method for mounting an edge connector assembly within a circuit module. Connector mounting rails are attached to the sides of a printed circuit board and the circuit board is then joined with a cold plate in order to form a circuit module. The mounting rail is an elongate strip of a substantially rigid material for attachment to the circuit board along one of its edges. The strip has an upper planar surface and inner and outer sides. The inner side is for attaching the strip to the edge of the circuit board. The outer side extends beyond the edge of the circuit board and is adapted to carry thereon a female block of the edge connector assembly. The strip also has a plurality of primary mounting openings formed in a predetermined pattern through the outer side of the strip for attaching the circuit board to a circuit module.

Apparatus and method for mounting edge connectors within a circuit module

A method and apparatus for adjusting power supplied to a device when the device has a first and a second power input. A first voltage level and a ground potential are provided and a second voltage level is created as a function of the first voltage level. The second voltage level is then buffered with a power transistor and, if the second voltage level is needed for a particular device, the buffered second voltage level is selectively applied to the device. The circuit is disabled when the second voltage supply is not needed.

Growing community of inventors

Chippewa Falls, WI, United States of America

Richard B Salmonson