Other

US Government As Represented by the Secretary of the Army

Xemet, Incorporated

Richard B Minch

Juergen L Pohlmann

A solid-state laser slab amplifier arrangement for the output of a laser m at optimal working conditions. Pump energy is applied to a solid state lasing material so as to irradiate the solid-state lasing material and effect a laser beam with resultant waste heat output. At least one micro-heatpipe bundle which includes multiple micro-heatpipes allows waste heat to be transported away by the working medium through an approximate center of an individual micro-heatpipe from the solid-state lasing material. After condensation, liquid working medium is returned substantially by capillary action through approximate off-center areas of the individual micro-heatpipe.

Micro-heatpipe cooling of solid-state slab

Rapid internal cooling of shape memory effect material actuators during cooling portion of thermal cycle by means of embedded micro-heat pipes enables one, two and three dimensional actuators comprised of composite structures with rapid response times. Structures are able to operate in high-temperature environments, have low thermal hysteresis, have improved positional control for robotics applications and enable large scale shape memory effect material actuators with rapid response characteristics.

Rapid shape memory effect micro-actuators

A diode laser array made from a plurality of linear laser diode array assemblies affixed and in good thermal communication with bodies containing micro-heatpipes. Assemblies are stacked in a vertical manner to form two dimensional arrays. Each assembly is connected electrically and mechanically to adjacent assemblies to form the final assembly. In one embodiment the bodies are arranged in a vertical stairstep manner such that radiation from an upper assembly stimulates emission in adjacent lower assemblies thereby achieving frequency locking. In another embodiment said micro-heatpipe containing second bodies are fabricated from materials with a coefficient of thermal expansion closely matching with a coefficient of thermal expansion closely matching that of the laser diode array subassemblies. In another embodiment the assemblies form the evaporator of a second heatpipe device cooling means.

Micro-heatpipe cooled laser diode array

The present invention relates generally to fluid flow control valves and more particularly to orifice assemblies of the type which are continuously adjustable wherein a high pressure reduction is divided into multiple smaller pressure drops to reduce total audible noise generation, flow is divided into multiple paths of small dimensions to reduce total audible noise level, suppress the low frequency audible noise levels, disperse the audible noise over a wider spectrum to avoid intense peaks, cavitation and erosion damage to the valve are reduced without the need for expensive special materials, pressure reduction is achieved by adaptive reduction in area as well as friction resulting efficient use of energy, the actuator energy and force requirements are low due to force balancing design, yet the valve is energy efficient and fast.

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Woodinville, WA, United States of America

Richard B Minch