International Business Machines Corporation

Panasonic Corporation

Richard B Booth

Ravi F Saraf

Judith Marie Roldan

Michael A Gaynes

Emanuel Israel Cooper

Carlos Juan Sambucetti

Steven Paul Ostrander

David T Shen

Janet E Poetzinger

Bradley S Gremban

Robert H Gephard

Gary W Grube

Igor Y Khandros

Peter Alfred Gruber

Arthur R Zingher

David R Engebretsen

Kenneth Michael Valk

Bruce Leroy Beukema

Jerzy Maria Zalesinski

Lawrence D David

Thomas R Sand

Harbans S Sachdev

Mark A Takacs

Herbert R Anderson, Jr

Mark O Neisser

Viswanadham Puligandla

Sol Krongelb

Gregoire J Le Grand De Mercey

Mark R Kordus

Edward A Giess

Robert M Murco

Robert M Murcko

A phase interpolation circuit based on injected passive capacitances and an inductance for forming a resonator. The circuit conducts at least a first reference signal having a first phase component and a second reference signal having a second phase component shifted from the first phase component. By selectively switching the first reference signal and/or the second reference signal through one or more capacitances, an interpolated third signal having a third phase component between the first phase component and the second phase component can be generated. An inductor is connected with one or more of the capacitances for forming a resonant circuit to boost the signal level of the interpolated third signal. By utilizing resonance, an improved signal-to-noise ratio may be obtained for the interpolated third signal. An additional amplification stage, secondary to the resonant circuit, may be incorporated for further amplifying the signal level of the interpolated third signal.

Phase interpolator based on an injected passive RLC resonator

A circuit arrangement, node, clustered computer system, and method incorporate a primitive communication mechanism for use in exchanging data between adjacent nodes coupled via a point-to-point network. A plurality of network ports are used to couple a node to other nodes in the clustered computer system over point-to-point network interconnects, and a plurality of communication registers are associated with each of the network ports for the purpose of storing data received through their associated network ports. A node desiring to communicate information to another node receives a port identifier from the other node that identifies the network port on the other node through which the pair of nodes are coupled. The port identifier is then used by the node to communicate data to the other node through the use of one or more write operations directed to the communication register on the other node that is associated with the network port identified by the port identifier. On the other node, a control circuit is used to automatically notify the other node whenever data is stored in any of its communication registers, e.g., by generating an interrupt in response to non-zero data being stored in any of such communication registers.

Primitive communication mechanism for adjacent nodes in a clustered computer system

A clustered computer system, bridge device and method include support for an atomic ownership change operation that ensures orderly and reliable ownership management of an input/output (I/O) bridge device. A lock indicator is associated with a bridge device, and is used to indicate a &ldquo;locked&rdquo; or &ldquo;unlocked&rdquo; status of the bridge device. Whenever the lock indicator indicates that the bridge device is unlocked, an atomic operation such as a read request to a lock indicator register is utilized to both set the indicator to indicate a locked status for the bridge device, and to associate the bridge device with a source node that initiated the atomic operation. In connection with the lock indicator, write access to one or more configuration parameter registers is controlled such that only the node that is associated with the bridge device is permitted to update such configuration parameter registers.

Atomic ownership change operation for input/output (I/O) bridge device in clustered computer system

An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.

Lead free conductive composites for electrical interconnections

A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.

Direct chip attachment (DCA) with electrically conductive adhesives

The present invention is directed to a process of a method for the full metallization of thru-holes in a polymer structure comprising the steps of applying a film-forming amount of a conductive polymer-metal composite paste to a metal cathode; bonding a patterned polymer structure to said paste; subjecting said polymer structure to an electrolytic plating bath for a time sufficient to fully metallize thru-hole surfaces in said patterned polymer structure and removing the structure from the cathode assembly. The fully metallized thru-hole polymer structure can then be cleaned and polished to produce a finished product.

Fabrication of double side fully metallized plated thru-holes, in

A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.

Parallel process interposer (PPI)

Method of fabricating a multi-layer integrated circuit chip interposer

A method of replacing IC chip package wiring having an interposer comprising removing an interposer having a plurality of adhesively laminated interposer layers from the package, delaminating and replacing at least one interposer layer with a corrected interposer layer, relaminating the interposer layers with adhesive thus producing a replacement interposer and remounting the replacement interposer to the IC chip package.

Method for replacing IC chip package interposer

A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Process for making a compliant thermally conductive compound

A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

Liquid metal matrix thermal paste

A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable thermal conduction and viscosity properties; is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

Compliant thermally conductive compound

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Wappingers Falls, NY, United States of America

Richard B Booth