Tyco Electronics Corporation

M/a -com, Inc.

Mia-com, Inc.

Richard Alan Anderson

Eswarappa Channabasappa

Terry P Bowen

Randall Brian Wilson

Noyan Kinayman

Ching-Long Jiang

John Baker Breedis

William Ring

Mark S Soler

Bernhard Alphonso Ziegner

Frank Stan Kolak

M Tekamul Buber

Jean-Pierre Lanteri

Thongchai Hongsmatip

Bernard A Ziegner

A connection arrangement for a micro lead frame plastic (MLP) package is provided that includes a paddle configured to be connected to a circuit board and a first ground pad and a second ground pad each connected to the paddle. The first and second ground pads together with the paddle are configured to provide continuity of ground between the circuit board and a chip mounted to the paddle.

connection arrangement for micro lead frame plastic packages

An antenna unit formed in the shape of a hollow box comprising (a) a substrate forming the front side of the antenna unit, (b) a first microstrip antenna array formed on the substrate, (c) a second microstrip antenna array formed on the substrate, (d) a ground plane forming the rear side of the antenna unit, and (e) a plurality of periodic filters formed on the ground plane. The periodic filters are formed by etching a series of circular patterns, or holes, through the ground plane. The periodic stop band filters provide for improved isolation between the microstrip antenna arrays, without the need for adding additional costly or space consuming components.

Microstrip antenna array with periodic filters for enhanced performance

The present invention relates to a technique for fabricating a mechanical or visual alignment fiducial on a laser die particularly adapted for application with a laser die that is a buried structure edge emitting laser. In fabricating the device, the fiducial and the active mesa are formed in the same photolithography patterning step, using conventional techniques. The active is then buried with regrowth layers. The regrowth layers are subsequently selectively etched to expose the fiducial, leaving the active region protected and buried.

Method for fabricating fiducials for passive alignment of opto-electronic devices

A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.

RF transition for an area array package

A spatial power divider/combiner that comprises: a housing containing a first channel forming three sides of a rectangular input waveguide and a second channel forming three sides of a rectangular output waveguide; a board coupled to the housing, wherein the underside of the board forms the fourth side of the input and output waveguides; a series of slots etched on the underside of the board located in the input waveguide to divide an input signal; a series of slots etched on the underside of the board located in the output waveguide to recombine the divided signal; and a series of microstrip lines printed on the top side of the board to couple the input waveguide and the output waveguide. Additionally, the divider/combiner can comprise a series of active devices, such as MMIC power amplifier, to provide a spatial power amplifier.

Compact slotted-waveguide spatial power divider/combiner/amplifier

Growing community of inventors

North Attleborough, MA, United States of America

Richard Alan Anderson