Church Dwight & Co., Inc.

Other

Church & Dwight, Inc.

Richard A Reynolds

Francis R Cala

Eric E Eichhorn

Frank Cala

Michael S Lunski

An alkaline aqueous cleaning composition for cleaning a substrate contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an ethoxylated C,alkanol surfactant having an HLB value at 25&deg; C. of from 8 to 12 and (b) an active concentration of at least one aminocarboxylic acid surfactant of the general formula R&mdash;N(H)&mdash;R&prime;, wherein R is a straight or branched chain aliphatic organic group having from 10 to 20 carbon atoms, and R&prime; is a straight or branched chain carboxylic acid having from 1 to 7 carbon atoms. At an active-concentration ratio of surfactant (a) to surfactant (b) of about 2.5:1, the surfactants have a synergistic effect on the cleaning composition's ability to remove certain types of industrial-soil contaminants. Cleaning of the substrate with the aqueous cleaning composition involves contacting the substrate with the composition for a period of time sufficient to remove at least a substantial portion of the contaminants from the substrate.

Aqueous cleaning composition for cleaning substrates and method of using same

A flux-removing, aqueous cleaning composition contains: (A) a solvent phase consisting essentially of water; and (B) a flux-removing phase containing an alkaline salt component and a surfactant formulation, the alkaline salt component containing at least one alkali metal salt, and the surfactant formulation containing at least one fluorinated surfactant and at least one N-alkylpyrrolidone surfactant. A method of removing rosin flux residues from a substrate, preferably a substrate of an electronic circuit assembly, involves (a) cleaning the substrate with the above-described aqueous cleaning composition for a period of time sufficient to substantially emulsify the soldering rosin flux residues to form emulsified rosin flux residues; and (b) removing the emulsified rosin flux residues from the substrate.

Flux-removing aqueous cleaning composition and method of use

A flux-removing, aqueous cleaning composition contains: (A) a solvent phase consisting essentially of water; and (B) a flux-removing phase containing an alkaline salt component and a surfactant formulation, the alkaline salt component containing at least one alkali metal salt, and the surfactant formulation containing at least one fluorinated, nonionic surfactant. A method of removing rosin flux residues from a substrate, preferably a substrate of an electronic circuit assembly, involves (a) cleaning the substrate with the above-described aqueous cleaning composition for a period of time sufficient to substantially emulsify the soldering rosin flux residues to form emulsified rosin flux residues; and (b) removing the emulsified rosin flux residues from the substrate.

Aqueous cleaning composition for removing flux and method of use

An alkaline aqueous cleaning composition for cleaning a substrate, e.g., a plastic or metal substrate, contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an N-octyl-2-pyrrolidone surfactant and (b) an active concentration of at least one aminocarboxylic acid surfactant. The active-concentration ratio of surfactant (a) to surfactant (b) is such as to provide the cleaning composition with the ability to remove a substantial portion of the contaminants from the substrate. At an active-concentration ratio of surfactant (a) to surfactant (b) of about 2.5:1, the surfactants have a synergistic effect on the industrial-soil-removing ability of the aqueous composition. Cleaning of the substrate with the aqueous cleaning composition involves contacting the substrate with the composition for a period of time sufficient to remove at least a substantial portion of the contaminants from the substrate.

Aqueous cleaning composition for cleaning substrates and method of using

An alkaline aqueous cleaning composition for cleaning a substrate contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an ethoxylated C.sub.12-14 alkanol surfactant having an HLB value at 25.degree. C. of from 8 to 12 and (b) an active concentration of at least one aminocarboxylic acid surfactant of the general formula R--N(H)--R', wherein R is a straight or branched chain aliphatic organic group having from 10 to 20 carbon atoms, and R' is a straight or branched chain carboxylic acid having from 1 to 7 carbon atoms. At an active-concentration ratio of surfactant (a) to surfactant (b) of about 2.5:1, the surfactants have a synergistic effect on the cleaning composition's ability to remove certain types of industrial-soil contaminants. Cleaning of the substrate with the aqueous cleaning composition involves contacting the substrate with the composition for a period of time sufficient to remove at least a substantial portion of the contaminants from the substrate.

An alkaline aqueous cleaning composition for cleaning a substrate contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an ethoxylated C.sub.9-11 alkanol surfactant having an HLB value at 25.degree. C. of from about 10 to about 12 and (b) an active concentration of at least one aminocarboxylic acid surfactant of the general formula:

Printing applicators such as metal stencils and screens used to apply solder paste to printed circuit boards are cleaned to remove accumulated solder paste therefrom by an aqueous alkaline salt cleaner. The aqueous cleaner of the present invention comprises alkaline salts such as alkali metal carbonates, a surfactant formulation which contains at least one nonionic surfactant, an alkali metal silicate corrosion inhibitor and stabilizers to maintain the components in aqueous solution. The cleaner of the present invention contains no VOCs and is an effective and safe replacement for alcohol solvents previously used to clean solder paste from screens and stencils.

Aqueous cleaner for removing solder pastes

Aqueous alkali cleaning compositions containing an alkali metal salt, an N-alkyl pyrrolidone derivative, and specific ethylene oxide/propylene oxide block copolymers having molecular weights of from about 1500 to about 2500. Such compositions can be employed as an aqueous concentrate or solution to clean a substrate such as a circuit board, wiring board or metal surface. Specific ethylene oxide/propylene oxide block copolymers protect plastic parts from corrosion by N-alkyl pyrrolidone derivatives without compromising N-alkyl pyrrolidone derivative cleaning ability.

Aqueous alkali cleaning compositions

An alkaline aqueous cleaning composition for cleaning a substrate, e.g., a plastic or metal substrate, contaminated with industrial-type soil contaminants contains (i) an aqueous portion and (ii) an active-ingredient portion composed of (A) an alkalinity-providing agent and (B) a surfactant mixture containing (a) an active concentration of an N-octyl-2-pyrrolidone surfactant and (b) an active concentration of at least one aminocarboxylic acid surfactant such as N-coco-beta-aminopropionic acid. The active-concentration ratio of surfactant (a) to surfactant (b) is such as to provide the cleaning composition with the ability to remove a substantial portion of the contaminants from the substrate. At an active-concentration ratio of surfactant (a) to surfactant (b) of about 2.5:1, the surfactants have a synergistic effect on the industrial-soil-removing ability of the aqueous composition. Cleaning of the substrate with the aqueous cleaning composition involves contacting the substrate with the composition for a period of time sufficient to remove at least a substantial portion of the contaminants from the substrate.

Aqueous alkaline cleaning composition containing surfactant mixture of

An aqueous flux removing composition is provided comprising alkali metal carbonate salts, an alkali metal silicate corrosion inhibitor and a surfactant formulation which comprises an N-alkylpyrrolidone. The N-alkylpyrrolidone is added in amounts sufficient to permit significantly faster cleaning speeds.

Flux removing compositions

Flux removing composition

Method of cleaning solder pastes from a substrate with an aqueous cleaner

The scale formed by use of alkaline salt-based cleaners and which comprises one or more alkaline salts and organic scale is removed by applying an aqueous solution comprising alkali metal carbonate salts and optionally, a hydrotrope to remove the organic scale. A mixture of potassium and sodium carbonate salts has been found to effect better descaling than use of either of the salts alone.

Aqueous alkaline metal descaling concentrate and method of use

A cleaning composition for removing water soluble flux residues from circuit assemblies comprises a surfactant formulation containing three nonionic surfactants which have cloud points which differ by at least 5.degree. F. from each other so as to provide optimum cleaning performance over a broadened temperature range. The surfactant formulation is preferably in the form of an aqueous concentrate which further contains alkaline salts, a corrosion inhibitor, a carboxylated polymer stabilizer to maintain the corrosion inhibitor in solution and a hydrotrope to maintain the surfactants in solution.

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Plainsboro, NJ, United States of America

Richard A Reynolds