Stauffer Chemical Company

Richard A Rehder

Jagadish C Goswami

Whiteford D Grimes

Anthony L DeSalvo

A novel adhesive exhibiting low outgassing upon exposure to high temperatures is disclosed. The instant adhesive comprises: (a) an epoxy resin, (b) a soluble polyimide resin, (c) a reactive solvent; and (d) an alkenylphenol crosslinker which preferably contains polyhydroxy and polyalkenyl substituents. Optionally, the adhesive may also contain a conductive material.

Rapid curing, thermally stable adhesive composition comprising epoxy

An inherently pliable polymeric marking film is disclosed which comprises a film component containing an internally plasticized vinyl chloride copolymer resin, a layer of pressure sensitive adhesive and, in preferred embodiments, a release coated protective liner. In certain embodiments, the polymeric marking film is destructible. The marking film has a small degree of shrinkage, shows exceptional conformability to irregular surfaces and has permanence of mechanical properties upon exposure to elevated temperatures.

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Mahopac, NY, United States of America

Richard A Rehder