Apple Inc.

Cooligy, Inc.

Richard A Herms

Jesse T Dybenko

Anthony Joseph Aiello

Kenneth E Goodson

Peng Zhou

Girish Upadhya

Arash Naghib Lahouti

Jonathan L Berk

Eric Andrew Knopf

Mark Munch

Mark McMaster

Paul Tsao

Cheng Ping Tan

Richard Grant Brewer

Karen Y Cheng

Dave B Corbin

James Hom

Brad Lee Patton

Trevor J Edmonds

Philippe P Herrou

Kwonil D Fleischman

Ashkan Rasouli

Halil Berberoglu

A cooling system for optimizing fan air flow performance without compromising acoustic performance is disclosed. At least three fan feature embodiments are disclosed: (1) sloped fan blades, (2) sloped impeller hubs, and (3) inlet flow guidance features. For the first embodiment, fan blades attached to an impeller disc and having leading edges that progressively curve toward a center of the impeller disc. For the second embodiment, the impeller disc is attached to and centered on an impeller hub that has a sloped hub surface that progressively curves toward the fan blades. For the third embodiment, an inlet flow guidance feature is positioned within a region surrounding a fan's inlet promoting smooth passage of air into the fan. In some embodiments, all three fan features are combined.

Method to reduce entrance losses to increase fan inlet flow and reduce acoustic noise

An electronic device with a fan assembly is disclosed. The fan assembly includes an impeller and an insert separated from the impeller by a gap. The fan assembly increases airflow by rotationally driving the impeller. For a sufficient rotational speed of the impeller, the airflow reaches a level that provides a force that displaces the insert. The displacement may include movement and/or compression of the insert. As a result of the displacement, the gap between the impeller and the insert increases. The increased gap reduces the pressure and associated noise that is otherwise caused by the airflow. When the rotational speed of the impeller reduces or ceases, the insert returns to its initial position. In this manner, the fan assembly includes a self-adjusting gap that changes based on the airflow.

Fan assembly with a self-adjusting gap and electronic devices with a fan assembly

A fan includes an impeller having blades of varying chord lengths. The fan includes a fan housing surrounding the impeller. The fan housing includes a protruding region, or throat, separated from each passing blade by a clearance, or throat gap, that varies according to the chord length. During rotation of the impeller, the impeller blades rotate about a rotational axis, passing the protruding region defining a minimum radial gap to the protruding region. Due to their different chord lengths, the impeller blades pass the throat region at different throat gaps. Shorter blades are likely to have lower amplitude static pressures and lower air velocities resulting at the blade tip, and are hence likely to generate a lower amplitude acoustic pulse at the protruding region. The variety of chord lengths modulate the amplitude of the pressure to spread acoustic sound across multiple frequencies thereby reducing peak amplitude of the acoustic sound.

Fan having a blade assembly with different chord lengths

In an exemplary electronic device with a cooling fan, a fan assembly is attached to a keyboard assembly of the electronic device. The fan assembly includes an impeller at least partially inside a fan enclosure. The fan enclosure has, on a surface, an inlet opening and an external protrusion. The electronic device further includes a bottom case. The fan assembly is positioned between the keyboard assembly and the bottom case and oriented such that the inlet opening and the external protrusion face the bottom case. The external protrusion maintains a passage between the fan enclosure and the bottom case that allows air to enter the inlet opening and also resists interference between the rotating impeller and the stationary bottom case.

Electronic device with cooling fan

The described embodiments relate generally to improving performance characteristics of a low profile fan. More specifically configurations having sloped fan blade edges are disclosed. By applying a gradual slope to each of the fan blades, performance of the fan can be increased without risking contact or rubbing between the fan blades and a fan housing. In some embodiments, the sloped fan blades can be configured to prevent contact when bearings of the fan include a certain amount of tilt play.

Fan performance by increasing effective blade height in a tolerance neutral manner

A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.

Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange

A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Semi-compliant joining mechanism for semiconductor cooling applications

A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.

Channeled flat plate fin heat exchange system, device and method

Growing community of inventors

Los Altos, CA, United States of America

Richard A Herms