Sensata Technologies, Inc.

Richard A Davis

Christopher A Lopez

Thomas F Lemczyk

David L Weston

A portable cooling system and apparatus for semiconductor device testing includes a free piston Stirling cooler. This eliminates the need for cumbersome remotely located equipment, such as a chillers, compressors, coolant storage equipment, hoses and hose connections. An electrical power line and an air supply line are routed from a head control unit to a portable system control unit. The head control unit is positioned by an adjustable frame structure to locate the Stirling cooler vertically directly over a semiconductor device under test. The head control unit includes a thermal adapter system, which is configured between the free piston Stirling cooler and the semiconductor device under test.

Free piston stirling cooler temperature control system for semiconductor test

Methods and apparatus for a package on package (POP) thermal forcing device. A thermal interposer includes a test probe guide and insulator top, a thermal conductor, the test probe guide and insulator top affixed to a top surface of the thermal conductor, a test probe, and a test probe guide and insulator bottom affixed to a bottom surface of the thermal conductor, the test probe guide and insulator bottom configured in a ring-like shape to enable the thermal conductor to pass through and make contact with a bottom of a package on package (PoP) integrated circuit (IC).

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Peoria, AZ, United States of America

Richard A Davis