Macdermid Enthone Gmbh

Jp Laboratories Inc.

Enthone Incorporated

Richard A Bellemare

Ernest Long

Durgadas Bolikal

Gordhanbhai N Patel

William J Decesare

Fengting Xu

Michael M Ryl

Jean W Chevalier

Ron Blake

Carmichael Gugliotti

Juan B Haydu

Edwin W Bastenbeck

James Watkowski

Donald Desalvo

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to. receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more blind micro-vias in the electronic substrate: and (3) electroplating copper in the at one or more through-holes and/or one or more blind micro-vias by contacting the electronic substrate with an acid copper electrolyte. The acid copper electrolyte is used to plate the one or more through-holes and/or the one or more blind micro-vias using a complex waveform including pulse reverse plating, DC plating and/or synchronous pulse plating. The complex waveforms can be used for filling through-holes and blind microvias with copper without defects.

Complex waveform for electrolytic plating

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.

Single step electrolytic method of filling through holes in printed circuit boards and other substrates

An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Silver/tin electroplating bath and method of using the same

Formulations are provided for pre-swelling and etching of functionalized polymers, such as polycarbonate in two or three steps. The etched surface can then be plated with electroless nickel or copper with satisfactory adhesion of the plated metals. Swelling agents make polymer molecules on and near the surface of the polymer easily accessible to a degradation agent. A degradation agent degradates the polymer molecules. If required, a solubilizing agent increases the miscibility of the degradation agent and the swelling agent. A wetting agent increases the effectiveness of the etching agent. In a two-step process, polymer parts are first treated with a solution of a swelling agent followed by etching with a solution of degradation agent.

Pre-swelling and etching of plastics for plating

Formulations are provided for pre-swelling and etching of functionalized polymers, such as polycarbonate in one, two and three steps. The etched surface can then be plated with electroless nickel or copper with satisfactory adhesion of the plated metals. Swelling agents make polymer molecules on and near the surface of the polymer easily accessible to a degradation agent. A degradation agent degradates the polymer molecules. If required, a solubilizing agent increases the miscibility of the degradation agent and the swelling agent. A wetting agent increases the effectiveness of the etching agent. In the one-step process, polymer parts are dipped in a solution containing at least one swelling agent and at least one degradation agent. In the two-step process, polymer parts are first treated with a solution of a swelling agent followed by etching with a solution of degradation agent. In the three-step process, polymer parts are first micro-roughened with a solution of a swelling agent, then etched with a solution of mineral acids followed by dipping in a caustic bath to make the surface wettable.

A process for specially conditioning and etching a polycarbonate resin prior to metal plating to enhance the coverage and adhesiveness of metal plating to the resin. The swellant composition comprises a compound represented by the general formula,

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Watertown, CT, United States of America

Richard A Bellemare