International Business Machines Corporation

Richard A Bates

Benjamin V Fasano

Subhash Laxman Shinde

Lester W Herron

Robert Hannon

David B Goland

Gregory M Johnson

Lisa M Studzinski

Andrew Michael Reitter

Carla Natalia Cordero

John Ulrich Knickerbocker

Jon Alfred Casey

Sarah Huffsmith Knickerbocker

James N Humenik

Srinivasa S Reddy

Robert W Nufer

Mark A Takacs

Steven M Kandetzke

John Acocella

George Czornyj

Renuka S Divakaruni

Arnold I Baise

Lovell B Wiggins

David R Clarke

Daniel P Kirby

Amy T Matts

Charles Hampton Perry

Lawrence D David

Ajay Prabhakar Giri

Anthony Mastreani

Peter A Agostino

Liang-Choo Hsia

Salvatore J Scilla

Ray M Bryant

Werner E Dunkel

Allen J Dam

Ananda H Kumar

Constance J Araps

Rao R Tummala

Nunzio DiPaolo

Herbert R Anderson, Jr

Heinz O Steimel

Nanik Bakhru

Suryanarayana Mukkavilli

Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Method for the controlling of certain second phases in aluminum nitride

Method for controlling of certain second phases in aluminum nitride

A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500.degree. C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.

Method for flat firing aluminum nitride/tungsten electronic modules

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Process for fabricating a low dielectric composite substrate

Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes:

Ceramic substrate having a protective coating thereon and a method for

Low dielectric composite substrate

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

In a soldering process for joining a plurality of metal components wherein a flux is employed to promote the process, the improvement comprises using as a flux in the process a flux consisting essentially of dihydroabietyl alcohol or dihydroabietyl alcohol and a member selected from the group consisting of a thermally depolymerizable polymer or a mixture of thermally depolymerizable polymers having the structure: ##STR1## where X and Y are n-alkyl and iso-alkyl not exceeding 6 carbon atoms; halogen; --COOR where R is n-alkyl and iso-alkyl not exceeding 6 carbon atoms; phenyl, naphthyl, tolyl and methyl-naphthyl groups; n is 5 to 500, and mixtures thereof.

Solder and braze fluxes and processes for using the same

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Wappingers Falls, NY, United States of America

Richard A Bates