International Business Machines Corporation

Richard A Bartley

Paul A Manfredi

Douglas P Nadeau

Raymond G Morris

Cuc Kim Huynh

Timothy Scott Chamberlin

Michael R Amsden

Michael R Amsden, Deceased

A brush conditioner for a semiconductor wafer cleaning tool including a pair if opposed, rotating flexible brushes. The conditioner is a wing-like structure having a leading edge and a trailing edge. The leading edge is forced against the rotating brushes flexing them to assist in removal of foreign material. The trailing edge tapers to a point and provides stability to the wing.

Brush conditioner wing

An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.

Polish pad conditioner with radial compensation

Disc shaped cleaning/polishing pads are disclosed for use on a cleaning/polishing apparatus wherein the surface of the cleaning/polishing pad comprises resilient members arranged in patterns which will facilitate the movement of fluids (deoinized water, chemical slurry, etc.) from the center region of the pad to the periphery of the pad. Arrangement of the resilient members on the pads may be spiral, swirl, concentric or any other suitable pattern which will direct fluids to the periphery of the pad upon rotation of the pad.

Silicon wafer cleaning and polishing pads

Growing community of inventors

Newburgh, NY, United States of America

Richard A Bartley