Technoprobe S.p.a.

Riccardo Liberini

Roberto Crippa

Flavio Maggioni

Raffaele Vallauri

Riccardo Vettori

Giuseppe Crippa

Filippo Dell'Orto

Giovanni Campardo

A probe card for a testing apparatus of electronic devices comprises a probe head housing a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto contact pads of a device under test, as well as a main support and an intermediate support connected to the main support and adapted to realize a spatial transformation of distances between contact pads on its opposite faces as a space transformer, the probe card suitably also comprising at least one connecting element adapted to link the space transformer and the main support, this connecting element having a substantially rod-like body and being equipped with a first end portion comprising at least one terminal section adapted to be engaged in a corresponding housing realized in the space transformer and with a second terminal portion adapted to abut onto an abutment element linked to the main support.

Probe card for a testing apparatus of electronic devices

A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10&#xd7;10&#xb0; C., the support being made of a metal material having a coefficient of thermal expansion lower than 6&#xd7;10&#xb0; C..

Probe card for a testing apparatus of electronic devices, particularly for extreme temperature applications

A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on the opposite sides thereof. Conveniently, the probe card comprises a support element which is joined to the intermediate support, this support element being made by means of a material having a greater stiffness than the intermediate support, thereby being able to provide local micro rectifications of the intermediate support.

High-planarity probe card for a testing apparatus for electronic devices

A probe card for an apparatus for testing electronic devices comprises at least one probe head, a plurality of contact probes housed within the probe head, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, a supporting plate of the probe head, an interface plate, a stiffener associating the supporting plate and the interface plate, a plurality of connecting elements with clearance disposed between the supporting plate and the interface plate and housed in a floating manner in a plurality of respective seats made in the supporting plate, and a plurality of connecting elements without clearance disposed between the interface plate and the stiffener.

Probe card for an apparatus for testing electronic devices

An interface board of a testing head for a test equipment of electronic devices is described. The testing head includes a plurality of contact probes, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, as well as a contact element for the connection with a board of the test equipment. Suitably, the interface board comprises a substrate and at least one redirecting die housed on a first surface of that substrate and a plurality of contact pins projecting from a second surface of that substrate opposed to the first surface. The redirecting die includes at least one semiconductor substrate whereon at least a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, the contact pins being suitable to contact the board.

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Cernusco Lombardone, Italy

Riccardo Liberini