Stmicroelectronics S.r.l.

Riccardo Emanuele Sarpietro

Salvatore Coffa

Francesco Rundo

Marco Alfio Torrisi

Michele Calabretta

In an embodiment, a method includes: capturing a first image of a power module, the power module including a power electronics circuit, the power electronics circuit including power semiconductor dies; identifying positions of the power semiconductor dies in the first image with a die detection model; extracting second images of the power semiconductor dies from the first image according to the positions of the power semiconductor dies in the first image; and identifying defects of the power semiconductor dies in the second images with a defect detection model, the defect detection model being different from the die detection model.

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Paternò, Italy

Riccardo Emanuele Sarpietro