Applied Materials, Inc.

Ricardo Martinez

Jagan Rangarajan

Shou-Sung Chang

Paul D Butterfield

Sen-Hou Ko

Antoine P Manens

Gary C Ettinger

Zhenhua Zhang

Y Sean Lin

Dmitry Sklyar

Brett Christian Hoogensen

Eric B Britcher

Eashwer Kollata

William Wadsworth

Tarun Kumar Abichandani

Lukas Sykora

Hung X Hoang

Sami Mustafa

Shih-Yu Liu

Leonard Giarto

Hung Xuan Hoang

Farooq Aleem

A fluid assembly includes a base and at least one first device. The base includes a single-piece body including a base outlet, a base inlet, and a first interface including a first interface inlet and a first interface outlet. The base also includes a first flow path segment formed within the single-piece body that extends from the base inlet to the first interface outlet. The base also includes a second flow path segment formed within the single-piece body that extends from first interface inlet. The base also includes a ground path disposed within the single-piece body. The first device is attachable to the first interface to fluidly connect a first device inlet to the first interface outlet and a second device outlet to the second interface inlet.

Modular fluid delivery assembly

In a substrate processing system, such as a chemical mechanical system, updated controller configuration data is obtained for a plurality of liquid flow controllers of the substrate processing system. Each of a plurality of liquid flow controllers (LFCs) coupled to an Ethernet for Control Automation Technology (EtherCAT) bus automatically downloads a copy of the updated controller configuration data through the EtherCAT bus. Each of the plurality of liquid flow controllers controls fluid flow of a separate fluid line from a plurality of fluid lines in the substrate processing system, fluid flow through the plurality of fluid lines is controlled using the plurality of liquid flow controllers having the updated controller configuration data.

Ethercat liquid flow controller communication for substrate processing systems

Apparatus and methods are provided to polish an edge of a substrate. The invention includes a polishing head adapted to retain a backing pad having a selected contour, wherein the polishing head is adapted to press the backing pad against an edge of a substrate. Numerous other aspects are provided.

Methods and apparatus for removal of films and flakes from the edge of both sides of a substrate using backing pads

Embodiments of the invention provide a liquid delivery system. The liquid delivery system generally includes a plurality of vessels flexibly coupled to a frame to provide vibration isolation therefrom. In one embodiment, the liquid delivery system includes tubing coupling liquids to/from the plurality of vessels, wherein the tubing is selected to minimize the transmission of mechanical noise to the plurality of vessels. In another embodiment, the liquid delivery system includes a controller adapted to monitor and control the delivery of the liquids throughout the system. In another embodiment, a method is provided to deliver liquids from storage vessels to substrate processing systems. Generally, the liquid delivery is completed using a first delivery step and a second delivery step wherein the amount of liquid delivered during the second delivery step is determined using the amount of liquid delivered from the first delivery step and controller by time to minimize the impacts of signal noise and delivery delay.

Liquid delivery system and method

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Manteca, CA, United States of America

Ricardo Martinez