Aehr Test Systems, Inc.

Rhea J Posedel

Larry J Lape

James Wrenn

Carl N Buck

Scott E Lindsey

Paul W Burke

Ernie Wang

See-Hack Foo

A system for testing integrated circuits is described. A contactor board of the system has pins with ends that contact terminals on a power and signal distribution board. Opposing ends of the pins make contact with die terminals on an unsingulated wafer. The distribution board also carries a plurality of capacitors, at least one capacitor corresponding to every die on the unsingulated wafer. Each capacitor may include two substantially flat planar capacitor conductors and a dielectric layer between the capacitor conductors. Alternatively, the capacitors may be discrete components mounted to and standing above the distribution board, in which case corresponding capacitor openings are formed in the contactor substrate to accommodate the capacitors when the distribution board and the contactor board are brought together. A plurality of fuses made of a polymer material are also provided. The polymer material limits the flow of current flowing therethrough when the temperature of a fuse increases, and increases the current therethrough when the temperature of the fuse decreases.

System for testing and burning in of integrated circuits

A reusable carrier 10 for temporarily holding an integrated circuit 12 during burn-in and electrical test includes a base 14 and a lid 16 attached to the base 14 by hinges 18. A flexible substrate 19 is attached to the base 14. Alignment posts 20 have tapered surfaces 22 that engage corners 24 of the integrated circuit 12 to position the integrated circuit 12 precisely on upper surface 26 of the substrate 19. A spring-loaded latch 28 engages projection 30 in aperture 32 of the base 14 to hold the lid 16 closed over the integrated circuit 12. Electrically conductive traces 34 on the surface 26 have contact bumps which engage contact pads on the underside of the integrated circuit 12 to connect the integrated circuit 12 to peripheral contact pads 38 around edges 40 of the substrate 19. A spring 42 engages upper surface 43 of the integrated circuit 12 when the lid 16 is in its closed position over the integrated circuit 12, to provide a biasing force to urge the contact pads against the conductive traces 34 with sufficient force to insure a reliable electrical connection. For burn-in, the temporary package 10 containing the integrated circuit die 12 is now loaded into a socket 48 on a burn-in board 50, which is then loaded into a burn-in system, where otherwise standard burn-in is performed.

Reusable die carrier for burn-in and burn-in process

A reusable carrier (10) for temporarily holding an integrated circuit (12) during burn-in and electrical test includes a base (14) and a lid (16) attached to the base (14) by hinges (18). A flexible substrate (19) is attached to the base (14) with a suitable adhesive. Alignment posts (20) have tapered surfaces (22) that engage corners (24) of the integrated circuit (12) to position the integrated circuit (12) precisely on upper surface (26) of the substrate (19). A spring-loaded latch (28) engages projection (30) in aperture (32) of the base (14) to hold the lid (16) closed over the integrated circuit (12). Electrically conductive traces (34) on the surface (26) have contact bumps which engage contact pads on the underside of the circuit (12) to connect the integrated circuit (12) to peripheral contact pads (38) around edges (40) of the substrate (19). A spring (42) engages upper surface (43) of the circuit (12) when the lid (16) is in its closed position over the integrated circuit (12), to provide a biasing force to urge the contact pads against the conductive traces (34) with sufficient force to insure a reliable electrical connection. For burn-in, the temporary package (10) containing the integrated circuit die (12) is now loaded into a socket (48) on a burn-in board (50), which is then loaded into a burn-in system, where otherwise standard burn-in is performed.

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Belmont, CA, United States of America

Rhea J Posedel