Arris Enterprises LLC

General Instrument Corporation

Reza A Saedi

Zoran Maricevic

Zhijian Sun

Dean Painchaud

Arthur C Paolella

Vipul Rathod

David Francis Lewandowski

James Swanson

A test point circuit includes a main RF signal path (e.g., transmission line, lumped-element network, etc.), a test point RF signal circuit, a test point structure having a center conductor and corresponding grounded sleeve and being configured for connecting to a test probe for monitoring the RF signal carried through the main RF signal path, and a switch between the main RF signal path and the test point RF signal circuit. In the open position of the switch, the signal in the main RF signal path is prevented from propagating to the center conductor of the test point structure. In the closed position of the switch, the RF signal can propagate from the main RF signal path to the center conductor of the test point structure. The test probe mated to the test point structure can then measure or monitor the RF signal carried through the main RF signal path.

Dis-engaging test point

Particular embodiments use aggregation logic that reduces the noise in a daisy-chained optical return signal aggregation of multiple nodes. The aggregation logic determines when an input to a transmitter/receiver is not used and disables or turns off that input. Further, in the case of daisy-chaining, a service group aggregation signal (e.g., RF signals) from the customer premise equipment (CPEs) serviced by a respective node are presented to the channel 'A' port of a digital return transmitter/receiver. However, internal to the transmitter/receiver, aggregation logic auto-senses what optical return signals have already been aggregated up to that point in the daisy chain and can then intelligently place the service group aggregation signal onto one of the digital return transmitter channels. In one embodiment, if there are two return channels, A and B, whichever of these channels has seen fewer aggregations up to this point, will receive the service group aggregation signal.

Upstream aggregation with noise performance improvement

A temperature controlled arrangement is provided for housing an optical component such as a laser diode that may be employed in a CATV system. The arrangement includes a package having an enclosure through which a plurality of electrical connections extend. At least one optical component is located in the enclosure and electrically connected to at least one of the electrical connections. A first thermoelectric cooler is also located in the enclosure and in thermal conduction with the optical component. A temperature sensor is located in the enclosure and electrically connected to at least one of the electrical connections. A second thermoelectric cooler, which is located external to the enclosure, is in thermal conduction with the enclosure.

Thermal cooler for a laser diode package

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Bryn Mawr, PA, United States of America

Reza A Saedi