Intel Corporation

Reynaldo Alberto Olmedo

William J Lambert

Kaladhar Radhakrishnan

Yongki Min

Clive R Hendricks

Leigh E Wojewoda

Venkat Anil K Magadala

Eric Jin Li

Joshua Heppner

Rajendra C Dias

Anna M Prakash

Venmathy McMahan

Ann Jinyan Xu

Sriya Sanyal

Tao Wu

Charavanakumara Gurumurthy

An apparatus comprises an inductor module including: a module substrate including a magnetic dielectric material; a plurality of inductive circuit elements arranged in the module substrate, wherein an inductive circuit element includes conductive traces arranged as a coil including a first coil end, a second coil end and a coil core, wherein the coil core includes the magnetic dielectric material; and a plurality of conductive contact pads electrically coupled to the first and second coil ends. The contact pads electrically coupled to the first coil ends are arranged on a first surface of the inductor module, and the contact pads electrically coupled to the second coil ends are arranged on a second surface of the inductor module.

Magnetic small footprint inductor array module for on-package voltage regulator

Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

Semiconductor package having an EMI shielding layer

Multiple surface finishes are applied to a substrate for a microelectronics package by applying a first surface finish to connection pads of a first area of the substrate, masking the first area of the substrate without masking a second area of the substrate, applying a second different surface finish to connection pads of the second area of the substrate, and removing the mask.

Multiple surface finishes for microelectronic package substrates

Growing community of inventors

Phoenix, AZ, United States of America

Reynaldo Alberto Olmedo