Growing community of inventors

Santa Clara, CA, United States of America

Rex Liebert Allison, Iii

Average Co-Inventor Count = 1.76

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 155

Rex Liebert Allison, IiiJeffrey Robert Perry (3 patents)Rex Liebert Allison, IiiWanda Carol Garrett (3 patents)Rex Liebert Allison, IiiMartin Garrison (3 patents)Rex Liebert Allison, IiiRichard Levin (3 patents)Rex Liebert Allison, IiiPhil Gibson (2 patents)Rex Liebert Allison, IiiKhang Duy Nguyen (2 patents)Rex Liebert Allison, IiiVandana A Sojrani (2 patents)Rex Liebert Allison, IiiJohn Perzow (1 patent)Rex Liebert Allison, IiiVandana Sojorani (1 patent)Rex Liebert Allison, IiiRex Liebert Allison, Iii (6 patents)Jeffrey Robert PerryJeffrey Robert Perry (27 patents)Wanda Carol GarrettWanda Carol Garrett (10 patents)Martin GarrisonMartin Garrison (7 patents)Richard LevinRichard Levin (4 patents)Phil GibsonPhil Gibson (6 patents)Khang Duy NguyenKhang Duy Nguyen (6 patents)Vandana A SojraniVandana A Sojrani (2 patents)John PerzowJohn Perzow (9 patents)Vandana SojoraniVandana Sojorani (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. National Semiconductor Corporation (3 from 4,791 patents)

2. Ixys Ch Gmbh (3 from 39 patents)


6 patents:

1. 8847531 - Sample and hold time stamp for sensing zero crossing of back electromotive force in 3-phase brushless DC motors

2. 8358093 - Sample and hold time stamp for sensing zero crossing of back elecromotive force in 3-phase brushless DC motors

3. 8030867 - Sample and hold time stamp for sensing zero crossing of back electromotive force in 3-phase brushless DC motors

4. 6931369 - Method to perform thermal simulation of an electronic circuit on a network

5. 6877033 - Network-based integrated device identification and ordering system

6. 6678877 - Creating a PC board (PCB) layout for a circuit in which the components of the circuit are placed in the determined PCB landing areas

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as of
12/30/2025
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