Esec, Trading Sa

Reto Schubiger

Stefan Behler

Beat Zumbuehl

Eugen Mannhart

Ruedi Grueter

Rolf Schuermann

An apparatus for mounting semiconductor chips comprises a loading station for the presentation of substrates, a first transport system and a second transport system. The first transport system removes one substrate after the other from the loading station and passes them on to the second transport system which transports the substrates in steps to a dispensing or soldering station and to a bonding station. A sensor with two coils arranged at a distance to one another is arranged in such a way that one end of the substrate transported by the first transport system travels through a gap formed between the two coils. The signal delivered by the sensor is used to determine a control signal which indicates whether or not the first transport system should pass the substrate on to the second transport system.

Apparatus for mounting semiconductor chips

A Die Bonder or a Wire Bonder contains a device for holding down a substrate. The device comprises a table with drill holes. The drill holes are mechanically programmable with regard to whether vacuum can be applied to them or not. The mechanical programming enables a fast and easy adaptation of the device to different substrates.

Die bonder and/or wire bonder with a device for holding down a substrate

A Die Bonder or Wire Bonder has a suction device for pulling flat and holding down a curved substrate equipped with or to be equipped with a semiconductor chip onto a supporting surface of a plate. The plate contains at least one cavity open towards the supporting surface in which there is a vacuum gripper made out of flexible material, whereby the vacuum gripper is lowerable into the cavity during transport of the substrate and which is raisable above the level of the supporting surface to apply suction to the substrate.

Growing community of inventors

Ebikon, Switzerland

Reto Schubiger