Flisom Ag

Ruehle, Ulfert

Reto Pfeiffer

Thomas Netter

Roger Ziltener

Marta Ruth

Embodiments of the present disclosure generally relate to evaporation sources used for physical vapor deposition of material onto substrates and more particularly for controlled coating of large substrates, such as vacuum deposition of copper, indium, gallium, selenium, tellurium, cadmium, or zinc on flexible substrates. Embodiments disclosed herein are able to control the evaporation rate of the source material during processing so as to obtain a uniform deposition across the width of the substrate as the complete length of a roll-to-roll substrate is moved past the evaporation source during processing.

Homogeneous linear evaporation source

A thin-film optoelectronic module device () and design method comprising at least three monolithically-interconnected cells () where at least one monolithically-interconnecting line () depicts a spatial periodic or quasi-periodic wave and wherein the optoelectronic surface of said thin-film optoelectronic module device () presents at least one set of at least three zones () having curves of substantially parallel monolithic interconnect lines. Border zones () have a lower front-contact sheet resistance than that of internal zone (). Said curves of substantially parallel interconnecting lines may comprise peaks of triangular or rounded shape, additional spatial periods that are smaller than a baseline period, and mappings from one curve to the adjacent curve such as in the case of non-rectangular module devices (). The device () and design method are advantageous to reduce costs and materials to manufacture thin-film optoelectronic module devices () while increasing production yield, reliability, aesthetic appearance, and range of applications.

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Pfäffikon, Switzerland

Reto Pfeiffer