Tel Manufacturing and Engineering of America, Inc.

Reo Kosaka

Kazuya Dobashi

Matthew C Gwinn

Masaru Nishino

Kenichi Oyama

Noriaki Okabe

Hiromitsu Kambara

Luis Fernandez

Sakurako Natori

A method of processing a substrate includes loading the substrate on a substrate holder. The substrate includes a major surface and a feature disposed over the major surface. The feature has a first width along an etch direction. The method includes exposing portions of the major surface and changing the first width of the feature to a second width along the etch direction by etching a first portion of the sidewalls of the feature with a gas cluster ion beam oriented along a beam direction.

Pattern enhancement using a gas cluster ion beam

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Hillsboro, OR, United States of America

Reo Kosaka