International Business Machines Corporation

Renuka S Divakaruni

Jon Alfred Casey

Srinivasa S Reddy

Steven M Kandetzke

Govindarajan Natarajan

Lawrence D David

Anthony Mastreani

Daniel P Kirby

Robert W Nufer

John Ulrich Knickerbocker

Lester W Herron

Shaji Farooq

Sarah Huffsmith Knickerbocker

James N Humenik

Donald Rene Wall

Rao Venkateswara Vallabhaneni

Mark A Takacs

Constance J Araps

John Acocella

Richard A Bates

Vivek M Sura

Arnold I Baise

Lovell B Wiggins

David R Clarke

Farid Youssif Aoude

Hal Mitchell Lasky

Amy T Matts

Charles Hampton Perry

Ajay Prabhakar Giri

George Czornyj

Herbert R Anderson, Jr

Peter A Agostino

Salvatore J Scilla

Liang-Choo Hsia

Werner E Dunkel

Allen J Dam

Ray M Bryant

Manfred Sammet

Krishna Gandhi Sachdev

Harbans S Sachdev

Srinivasa S N Reddy

Raj N Master

Darbha Suryanarayana

Catherine A Lotsko

Stoyan M Zalar

Joseph M Dynys

Chatherine A Lotsko

A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

Copper-based paste containing copper aluminate for microstructural and

A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.

Ceramic via composition, multilayer ceramic circuit containing same, and

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

Process for fabricating a low dielectric composite substrate

Phenyl-endcapped depolymerizable polymers are disclosed. The phenyl endcap eliminates the reactive terminal vinyl group resulting in increased depolymerization threshold temperatures and reduced residue after depolymerization. A multilevel metal lift-off process using the phenyl-endcapped polymers is disclosed. Additionally, the polymers are improved ceramic glass binder resins.

Phenyl-endcapped depolymerizable polymer

Low dielectric composite substrate

The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addresssed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.

The present invention provides a method for producing multilayered ceramic structures having copper-based conductors therein, wherein the onset of sintering of the copper-based conductor can be adjusted to approach or match that of the ceramic portion of the structure. In addition, methods are provided whereby the polymeric binder resin used in formation of the ceramic portion of the structure can be removed or burned-off, using oxygen-containing ambients, wherein the oxygen content is greater than 200 ppm, without oxidation of the copper-based conductors therein.

Method of making multilayered ceramic structures having an internal

In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.

Method of bonding inorganic particulate material

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Ridgefield, CT, United States of America

Renuka S Divakaruni