Toyota Jidosha Kabushiki Kaisha

Ngk Insulators, Inc.

Mitsubishi Cable Industries, Ltd.

Rentaro Mori

Hiroshi Yanagimoto

Kazuaki Okamoto

Haruki Kondoh

Keiji Kuroda

Sumio Kamiya

Akira Kato

Yoshiyuki Kasai

Yoshimasa Omiya

Kenji Nakamura

Akira Kiyama

Yoshio Honda

Nobuhiko Sawaki

Itsuo Kamiya

Tomoya Okazaki

Jyunya Murai

Hitoshi Ishii

Hiroya Inaoka

Susumu Sarai

Masayuki Ichiyanagi

Takeo Kobayashi

Masashi Hamakubo

Yasuyuki Yanase

Kazuhiko Kobiki

Yukihiro Kato

Provided is a method for manufacturing a wiring board that forms a wiring layer having favorable adhesion without a resin resist pattern. A method prepares a substrate with seed-layer including: a underlayer on the surface of an insulating substrate; and a seed layer on the surface of the underlayer, the seed layer having a predetermined pattern and containing metal; presses a solid electrolyte membrane against the seed layer and the underlayer, and applies voltage between an anode and the underlayer to reduce metal ions in the membrane and form a metal layer on the surface of the seed layer; and removes an exposed region without the seed layer and the metal layer of the underlayer to form a wiring layer including the underlayer, the seed layer and the metal layer on the surface of the substrate.

Method for manufacturing wiring board, and wiring board

A method for manufacturing a wiring board in which the adhesion between an underlayer and a seed layer is improved. A diffusion layer in which an element forming the underlayer and an element forming a coating layer are mutually diffused is formed between the underlayer and a wiring portion of the coating layer by irradiating the wiring portion with a laser beam. A seed layer is formed by removing a portion excluding the wiring portion of the coating layer from the underlayer. A metal layer is formed by disposing a solid electrolyte membrane between an anode and the seed layer and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from an insulating substrate.

Method for manufacturing wiring board

First, a patterned substrate including an insulating substrate, a conductive seed layer, and an insulating layer is prepared. The seed layer is disposed on the insulating substrate, and consists of a first part having a predetermined pattern corresponding to the wiring pattern and a second part as a part other than the first part. The insulating layer is disposed on the second part of the seed layer. Subsequently, a metal layer having a thickness larger than a thickness of the insulating layer is formed on the first part of the seed layer. Here, a voltage is applied between an anode and the seed layer while a resin film containing a metal ion-containing solution is disposed between the patterned substrate and the anode and the resin film and the seed layer are brought into pressure contact. Subsequently, the insulating layer and the second part of the seed layer are removed.

A method for manufacturing a wiring board capable of improving adhesion between an underlayer and a seed layer. An electrically conductive underlayer is disposed on the surface of an insulating substrate and a seed layer containing metal is disposed on the surface of the underlayer to prepare a substrate with seed-layer. A diffusion layer in which elements forming the underlayer and seed layer are mutually diffused is formed between the underlayer and the seed layer, by irradiating the seed layer with a laser beam. A metal layer is formed on the surface of the seed layer by disposing a solid electrolyte membrane between an anode and the seed layer as a cathode and applying voltage between the anode and the underlayer. An exposed portion without the seed layer of the underlayer is removed from the insulating substrate.

The present disclosure provides a method for producing a wiring substrate. A seeded substrate is first prepared. The seeded substrate includes an insulation substrate, a conductive undercoat layer having a hydrophilic surface and provided on the insulation substrate, a conductive seed layer provided on a first region of the surface of the undercoat layer, the first region having a predetermined pattern, and a water-repellent layer on the second region of the surface of the undercoat layer, the second region being a region other than the first region. Subsequently, a metal layer is formed on the seed layer. A voltage is applied between the anode and the seed layer while a solid electrolyte membrane being disposed between the seeded substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the water-repellent layer and the undercoat layer are etched.

Method for producing wiring substrate

A method for manufacturing a wiring board is capable of forming a metal layer included in a wiring layer to have an even thickness. The method includes preparing a conductive first underlayer on a surface of a substrate; a conductive second underlayer on a surface of the first underlayer; and a seed layer on a surface of the second underlayer and containing metal. The method disposes a solid electrolyte membrane between an anode and the seed layer as a cathode; applies voltage between the anode and the first underlayer to form a metal layer on the surface of the seed layer; removes an exposed portion of the second underlayer without the seed layer from the substrate; and removes an exposed portion of the first underlayer without the seed layer from the substrate. The first underlayer is a material having a higher electrical conductivity than that of the second underlayer.

A seeded substrate is first prepared. The seeded substrate includes an insulation substrate having a main surface composed of a first region and a second region other than the first region, and a conductive seed layer provided on the first region. Subsequently, a conductive layer is formed on at least the second region to obtain a first treated substrate. An insulation layer is then formed on the first treated substrate. The seed layer is then exposed. A metal layer is then formed on the surface of the seed layer. Here, a voltage is applied between the anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing solution being disposed between the second treated substrate and the anode, and the solid electrolyte membrane and the seed layer being pressed into contact with each other. Thereafter, the insulation layer and the conductive layer are removed.

The present disclosure provides a method for producing a wiring substrate. A seeded substrate including an insulation substrate, a conductive undercoat layer, and a conductive seed layer provided in a first region, in that order, is first prepared. An insulation layer covering the seed layer and the undercoat layer is then formed. Subsequently, the insulation layer is etched to expose a surface of the seed layer and form a remaining insulation layer covering the undercoat layer in the second region. Subsequently, a voltage is applied between an anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing aqueous solution disposed between the seed layer and the anode and the membrane and the seed layer pressed into contact with each other, thereby a metal layer being formed on the surface of the seed layer. Thereafter, the remaining insulation layer is removed and the undercoat layer is etched.

Provided is an electrically heated catalytic converter including at least a conductive substrate and an electrode member that is fixed to the substrate, in which a protective film is formed on a surface of at least a portion of the electrode member. In the electrically heated catalytic converter, at least a portion of the protective film is formed of AlO, SiO, a composite material of AlOand SiO, or a composite oxide including AlO, SiO, or a composite material of AlOand SiOas a major component, the protective film has an amorphous structure or a partially crystalline glass structure having a crystallization rate of 30 vol % or lower with respect to the entire portion of the protective film, and a thickness of the protective film is in a range of 100 nm to 2 &#x3bc;m.

Electrically heated catalytic converter and method of manufacturing the same

A joint structure jointing a ceramic member and a metal member is a joint structure jointing a ceramic member and a metal member that are provided in a device provided on a portion through which gas passes. The joint structure has a joint portion that joints the ceramic member and the metal member. The joint portion includes a glass portion made of a glass and a metal solder portion having higher corrosion resistance with respect to the gas than the glass. An area where the metal solder portion contacts to the gas is larger than an area where the glass portion contacts to the gas.

Ceramic member and joint structure of metal members

An electrically heated catalyst device that can uniformly heat a catalyst via comb-shaped electrodes even when current is repeatedly made to flow through the electrodes. The device includes a carrier having a metal catalyst supported thereon, a pair of comb-shaped electrodes each having wire portions, a base layer between each comb-shaped electrode and the carrier, and a fixation layer for fixing each wire portion on the base layer. The fixation layer is rectangular in shape when the outer peripheral surface of the carrier is seen from a direction orthogonal to the central axis of the carrier along the longitudinal direction of the device. A pair of opposite first sides of the fixation layer are parallel with the extending direction of each wire portion on opposite sides thereof, and a pair of second sides coupling opposite ends of the first sides are orthogonal to the extending direction of each wire portion.

Electrically heated catalyst device

An electrically-heated catalytic converter includes: a substrate made of ceramic, the substrate including a catalyst coated layer; electrode films made of ceramic, the electrode films being disposed on a surface of the substrate; electrode terminals made of ceramic, each of the electrode terminals being secured to a corresponding one of the electrode films; and external electrodes each attached to a corresponding one of the electrode terminals via a brazing filler metal. A thermal expansion coefficient of the brazing filler metal is equal to or higher than a thermal expansion coefficient of the electrode terminals, and is equal to or lower than a thermal expansion coefficient of the external electrodes. The thermal expansion coefficient of each of the electrode terminals decreases from a portion at which the electrode terminal is joined to the brazing filler metal toward a portion at which the electrode terminal is joined to the corresponding electrode film.

Electrically-heated catalytic converter

Provided are a composite material that has lower volume resistivity in comparison with SiC, SiC&#x2014;Si, and the like, which are materials for forming constituent elements of an EHC, has low temperature dependence of volume resistivity, and thus is able to form a constituent element of a high-performance EHC; an electrode film, an electrode terminal, and a honeycomb substrate that are constituent elements of an EHC formed with such composite material, and a method for producing them. The composite material contains MoSiand at least one of Si or SiC, and is a material for forming a constituent element of an electrically heated catalytic converter. An electrode film, an electrode terminal, and a substrateare produced from such composite material.

Composite material, electrode film and method for producing the same, electrode terminal and method for producing the same, substrate and method for producing the same, and bonding material and method for producing substrate by bonding split parts together with bonding material

According to the present invention, a sealing material for a high-pressure hydrogen container, which mainly comprises a silicone rubber composed of a dimethyl siloxane segment, a methyl vinyl siloxane segment, and a diphenyl siloxane segment, and a high-pressure hydrogen container using the sealing material are provided. In order to seal a high-pressure hydrogen container (CHG tank) system for fuel cell vehicles with an elastomer, the elastomer has (1): excellent durability in a variable pressure environment of high-pressure hydrogen; and (2): excellent sag resistance in low-temperature to high-temperature environments, and thus the significant technical objectives (1) and (2) have been achieved.

Growing community of inventors

Kasugai, Japan

Rentaro Mori