Sensirion Ag

Invensense, Inc.

René Hummel

Felix Mayer

Markus Graf

Werner Hunziker

Dominik Niederberger

Ulrich Bartsch

Matthias Streiff

Marc Von Waldkirch

Stefan Thiele

Franziska Brem

Stephan Braun

Urs Rothacher

Johannes Schumm

Robert Sunier

Thomas Kraehenbuehl

Mathias Deschler

Ralph Steiner Vanha

Cyrill Kuemin

Andreas Reinhard

Johannes Bühler

Nicolas Daix

Marcel Pluess

Tang Tsung Lin

Lin Chung-Hsien

Marc Gubser

Frank Röck

Peter Morf

Chung-Hsien Lin

Tsung-Lin Tang

Chia-Min Lin

Wang-Shen Su

Lukas BÜRGI

Lin Chia Min

Su Wang Shen

A differential pressure sensor comprises a membrane arranged over a cavity on a semiconductor substrate. A lid layer is arranged at the top side of the device and comprises an access opening for providing access to the top side of the membrane. A channel extends laterally from the cavity and intersects with a bore. The bore is formed by laser drilling from the bottom side of the substrate and provides access to the bottom side of the membrane. The bore extends all through the substrate and optionally into the lid layer.

Method for manufacturing an intergrated pressure sensor

A method and device are disclosed for calibrating sensors, which sensors are arranged on semiconductor chips and are e.g. to be used for detecting a substance in a fluid. The sensors are calibrated while they are still assembled on a semiconductor wafer by exposing the wafer to a calibration fluid containing a known amount of the substance to be measured. Hence, rather than first cutting the wafer, the sensors are calibrated at an early stage. For this purpose, they are placed on a chuck below a lid. The calibration fluid with known parameters is introduced between the wafer and the lid. This allows to test and calibrate a large number of sensors quickly.

Method and device for calibration sensors

A method for packaging a sensor device having a sensitive structure integrated on a semiconductor chip is provided. When molding the device package, an inward extending section of the mold maintains an access opening to the sensor. A buffer layer is arranged on the chip between the inward extending section and the sensitive structure. The buffer layer protects the sensitive structure from damage by the inward extending section and acts as a seal while casting the housing. The buffer layer also covers at least part of the semiconductor electronic components of the circuitry integrated onto the chip. By covering these components, mechanical stress, as it is e.g. caused by different thermal expansion coefficients of the packaging and the chip, can be reduced.

Method for manufacturing a sensor device with a stress relief layer

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Zurich, Switzerland

René Hummel