Giesecke & Devrient Gmbh

Gao Gesellschaft Fur Automation Und Organisation Mbh

Renee-Lucia Barak

Yahya Haghiri-Tehrani

Albert Ojster

Helmut Baader

Klaus Vedder

Yahya Haghiri

Touba Haghiri-Tehrani, Legal Representative

Sina Haghiri-Tehrani, Legal Representative

Yahya Hagiiiri-Teiirani

Szahra Haghiri-Tehrani, Legal Representative

Mana Haghiri-Tehrani, Legal Representative

The invention relates to a portable data carrier () with a break-out mini smart card () embedded therein. The mini smart card () is separated from the remaining card body by a free punch () extending over substantial parts of the mini smart card. According to the invention, the mini smart card () contains another rated breaking line () having a different break-out direction from that of the mini smart card.

Portable data support with a detachable mini chip card

A portable data carrier with a break-out mini smart card embedded therein. The mini smart card is separated from the remaining card body by a free punch extending over substantial parts of the mini smart card. According to the invention, another rated breaking line is provided within the mini smart card, preferably consisting of a perforated line and permitting further reduction in size of the mini smart card.

Portable data support with a break-off mini-chip card

Data carrier with an electronic module and a method for producing the

A lead frame module to be incorporated in data carriers is presented which is divided into two areas, namely a central area receiving the sensitive components of the module, and an outer area protruding beyond the edge of the central area and serving to glue the lead frame module to the data carrier. To prevent forces from being transmitted from the outer area of the electronic module to the central area upon bending loads of the data carrier, the outer area is decoupled mechanically from the central area. This can be done for example by providing partial discontinuities including relieving punchings in the transition between the central and outer area.

Electronic module and a data carrier having an electronic module

Method and apparatus for producing a plastic molded chip card having

The invention relates to a method for incorporating a carrier element or module in a card body. The card body is provided with a recess shaped accordingly for incorporating the carrier element. The carrier element comprises a substrate on which an integrated circuit is disposed. Before the carrier element is incorporated a contact adhesive element is first introduced into the recess by means of a suitable tool. The carrier element can then be connected firmly and permanently with the card body with the aid of the contact adhesive element under the action of pressure.

Method for incorporating a carrier element

A process for manufacturing a carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Method for manufacturing an encapsulated semiconductor package using an

A carrier element is described that has one or more ICs to be incorporated into an identity card or credit card. The carrier element comprises a substrate having on its surface a plurality of contact areas which are connected via connector paths to corresponding terminals of the IC disposed on the substrate. The IC, including the connections to the conductor paths, is protected from mechanical stresses by a cured casting compound. In order to prevent the casting compound from flowing off uncontrollably during its application, an opening is provided in the heat-set adhesive layer applied to one side of the substrate, said opening holding back the liquid resin during its application and acting as a limiting frame. The opening in the adhesive layer is located at least where the IC is to be disposed.

Growing community of inventors

Unterhaching, Germany

Renee-Lucia Barak