International Business Machines Corporation

Renee L Weisman

Hsichang Liu

Govindarajan Natarajan

Raschid Jose Bezama

Eric D Perfecto

Mark J LaPlante

Krystyna Waleria Semkow

Brian Richard Sundlof

Kamalesh K Srivastava

Julien Sylvestre

Jay A Bunt

Donald W Diangelo

Thomas A Kline

Cristian Docu

Thomas Foley

Melvin R Gottschalk, Jr

Lisa A Hamilton

Sebastian Loscerbo

Olga A Otieno

Charles Leon Arvin

Gareth Geoffrey Hougham

Peter Jeffrey Brofman

Donald W Henderson

James C Utter

Alexandre Blander

Michael A Gaynes

Minhua Lu

Jon Alfred Casey

Jeffrey Allen Zitz

James A Busby

Mario John Interrante

David James Alcoe

James N Humenik

Rao Venkateswara Vallabhaneni

Randall Joseph Stutzman

William Edward Sablinski

Robert William Pasco

Harvey Charles Hamel

Brenda Lee Peterson

Ananda H Kumar

Srinivasa S N Reddy

Jawahar P Nayak

Jeffrey Thomas Coffin

Valerie A Oberson

Michael E Cropp

Paul F Findeis

John P Gauci

Alvin W Buechele

Gerald H Leino

Deborah Anne Sylvester

John A Trumpetto

Karl Otto Muggenburg

Megan J Shannon

Avinash S Adwalpalker

Arnold W Terpening

James M Blazick

Frank V Ranalli

James M Garland

Christopher Todd Spring

Srinivasa Sn Reddy

Amy C Flack

In one embodiment of the present invention, inert nano-sized particles having dimensions from 1 nm to 1,000 nm are added into a solder ball. The inert nano-sized particles may comprise metal oxides, metal nitrides, metal carbides, metal borides, etc. The inert nano-sized particles may be a single compound, or may be a metallic material having a coating of a different material. In another embodiment of the present invention, a small quantity of at least one elemental metal that forms stable high melting intermetallic compound with tin is added to a solder ball. The added at least one elemental metal forms precipitates of intermetallic compounds with tin, which are dispersed as fine particles in the solder.

Additives for grain fragmentation in Pb-free Sn-based solder

Semiconductor packaging techniques are provided which optimize metallurgical properties of a joint using dissimilar solders. A solder composition for Controlled Collapse Chip Connection processing includes a combination of a tin based lead free solder component designed for a chip and a second solder component designed for a laminate. The total concentration of module Ag after reflow is less than 1.9% by weight. A method of manufacturing a solder component is also provided.

Optimization of metallurgical properties of a solder joint

An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.

Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers

An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.

Fast firing flattening apparatus for sintered multilayer ceramic electronic substrates

Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates

Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

EMI shielding for semiconductor chip carriers

Multi-level web structure in use for thin sheet processing

A process of forming a multi-layer feature on a ceramic or organic article in which first and second layers of paste are sequentially screened through a screening mask wherein the screening mask has not been moved between screening steps. A structure produced by this process is also disclosed.

Single mask screening process

A process for reworking of PGA chip carriers where one or more I/O pins is unplated. The process includes electrolytically etching the I/O pins which removes any corrosion product from the unplated I/O pins and removes the top gold layer from the remaining I/O pins. The etchant includes a metal-providing compound selected from the group consisting of a silver salt, copper cyanide, silver cyanide, gold cyanide or mixtures thereof, at a concentration in the range from about 2.7 to about 4.1 g/l as metal; potassium or sodium carbonate at a concentration in the range from about 10 to about 100 g/l; and potassium or sodium cyanide at a concentration in the range from about 29 to about 35 g/l.

Process of reworking pin grid array chip carriers

A method of expanding a sintered alumina substrate which includes the step, after conventional sintering, of heating the sintered alumina substrate to a temperature of about 1340 to 1380.degree. C. and holding at the temperature for a predetermined time but no less than 15 minutes, the heating step causing the sintered alumina substrate to expand.

Method to resize sintered ceramic substrates

A screening apparatus including a table for holding an article; and a dual reservoir dispensing assembly. The dual reservoir assembly includes first and second reservoirs for holding first and second materials to be dispensed; first and second nozzles in communication with first and second reservoirs, respectively, for dispensing first and second materials; tilting apparatus for tilting the nozzles in a first direction so that the first nozzle is tilted into position for dispensing the first material and for tilting the nozzles in a second direction so that the first nozzle is tilted out of position and the second nozzle is tilted into position for dispensing the second material; and apparatus for moving the dual reservoir dispensing assembly with respect to the table wherein, in operation, the first nozzle is tilted into position during a first movement across the article and the second nozzle is titled into position during a second movement across the article.

Screening apparatus including a dual reservoir dispensing assembly

A re-work method for removing extraneous plated metal layer areas from the surface of a ceramic substrate containing refractory metal areas wherein the substrate is heated at a temperature for a time sufficient to strengthen the bond between the plated metal layer and the refractory metal areas while simultaneously reducing the strength of the bond between the extraneous plated metal layer overlying the ceramic and the ceramic, immersing the substrate in a liquid, and applying localized ultrasonic energy in close proximity to the extraneous metal areas to be removed.

Re-work method for removing extraneous metal from cermic substrates

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Poughkeepsie, NY, United States of America

Renee L Weisman