Lumileds LLC

Rene Van Honschooten

Axel Mehnert

Marcus Franciscus Donker

Dusan Golubovic

Hendrik Jan Eggink

Theodoor Cornelis Treurniet

A device is provided that comprises a metallic substrate defining a plurality of openings, the openings having a first area. The openings form one or more heat dissipating elements having a second area. The device comprises a plurality of sites on a surface of the one or more heat dissipating elements. Each site is configured to receive a light emitting element. The device comprises a plurality of conductor elements having a third area. The conductor elements are physically separated from the one or more heat dissipating elements by the openings. The conductor elements are configured to enable electrical connections to the light emitting elements and are electrically isolated from the one or more heat dissipating elements.

LED package with integrated features for gas or liquid cooling

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

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San Jose, CA, United States of America

Rene Van Honschooten