Societe Anonyme Dite: Alcatel Cit

Compagnie Industrielle Des Telecommunications Cit-alcatel

Rene Septfons

Michel Rabartin

Jean Chenu

The edge terminal pad is intended to receive a connection pin (30). It has two tinnable area solder blobs (17, 18) placed overlying each other on opposite faces of a margin of a substrate (10) at locations which are grasped by the claws (33, 34, 35) of the pin (30), with said claws forming the jaws of a resilient clamp. The tinnable area solder blob (17, 18) are notched by grooves (19, 20) at the locations of slide paths followed by the claws (33, 34, 35) while the pin (30) is being put into place. For a pin (30) having three claws with the combined width of all three claws being the same as the width of a terminal pad, one of the pad's tinnable area solder blobs (17) is generally U-shaped, while the other (18) is generally T-shaped. The advantage of the grooves is to restrict the amounts by which the clamp of the pin needs to open and to automatically center the pin on the pad, providing the pin is put into place after the tinnable areas (17, 18) have already been tinned.

Terminal pad for fixing a clawed pin to the edge of a hybrid circuit

The invention relates to cooling integrated circuit packages (14) for surface mounting in a hybrid circuit. The invention provides a cooling method which consists in soldering the bottom of the integrated circuit package (14) to one side of the hybrid circuit substrate (10) and in soldering a heat-dissipating peg (30) to its other side. In order to do this, the bottom of the package is provided with a tinnable area and the substrate (10) is provided with two overlying tinnable areas on opposite faces thereof, said areas being put into communication with each other by at least one plated-through hole (31). The peg (30) is pierced by a channel terminating in a capillary which opens out adjacent to the substrate and which leads to at least one solder receptacle (64, 67) opening out into a side wall of the peg, said channel serving to absorb any excess solder from beneath the bottom of the integrated circuit package (14) which might otherwise give rise to short circuiting solder bridges between connection pads or else prevent the integrated circuit package (14) from being pressed adequately against the substrate (10).

Method and device for cooling an integrated circuit package

A component fixing machine for hybrid circuits including heating station (5) and a cooling station (6) which are both mounted on a common carriage (17) which is driven in translation back and forth under a fixed station (4) for holding the substrate (1) above the carriage.

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Paris, France

Rene Septfons