International Business Machines Corporation

Robert Boschgmbh

Rene Schrottenholzer

Michael Frank

Gerhard H Ruehle

Harald Pross

Willi Recktenwald

Mike Uhlig

Manfred Cwik

A temperature measurement appliance for contactless temperature measurement, in particular a handheld temperature measurement appliance, includes a housing and at least one sensor that is disposed on the housing. The at least one sensor is configured to measure one or more of a relative air humidity and an ambient temperature. The temperature measurement appliance further includes at least one protective cap that is configured to be reversibly arranged on the temperature measurement appliance so as to mechanically protect the at least one sensor. The temperature measurement appliance further includes one or more features arranged on the temperature measurement appliance that are configured to detect an arranged state of the at least one protective cap. A method for operating the temperature measurement appliance includes detecting the arranged state of the protective cap on the temperature measurement appliance.

Temperature measurement appliance and method for the operation thereof

A contact assembly comprised of two parts bonded (e.g., welded) together, the first part including a male pin portion and the second part including a cylindrical jacket terminating in a flat end surface adapted for being electrically coupled (e.g., soldered) to a conductor (e.g., pad) on a substrate (e.g., PCB). Several contact assemblies may be positioned within a housing or substrate, to form a connector assembly which may then be positioned on and electrically coupled to a second substrate (e.g., a PCB), forming an electronic assembly.

Contact assembly, connector assembly utilizing same, and electronic assembly

According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.

Low inductance multiple resistor EC capacitor pad

Growing community of inventors

Gaeufelden, Germany

Rene Schrottenholzer