Intel Corporation

Rene J Sanchez

Nader N Abazarnia

Roderick E Kronschnabel

Matthew J Schneider

Steven W Whitehorn

Cecilia Yancy

Ryan R Carnaghi

Thomas V Moss

Christopher L Ross

Keith A Swesey

Marcie M Miller

Kevin Edwards

Paul J Diglio

Todd R Coons

Morten S Jensen

Christopher Roy Schroeder

Sruti Chigullapalli

Tuan Hoong Goh

A capacitive proximity sensor may include a proximity sensing capacitor to provide a voltage output based on a voltage input, the capacitor including a ground plane and an electrode loop capacitively coupled to the ground plane. The proximity sensor may include a processor to detect an object proximity based on a change in the voltage output. This proximity sensor provides automated detection of a person, and thereby reduces the need for a vehicle occupant or child caregiver to activate a sensor by pressing a button. The use of a capacitance-based proximity sensor reduces issues associated with fabric, clothing, or other materials separating the proximity sensor from a person.

Capacitive proximity sensing

Embodiments of alignment fixtures for integrated circuit (IC) packages, and related techniques, are disclosed herein. In some embodiments, an alignment fixture for an IC package may include: a first socket having a recess dimensioned to receive a first surface of the IC package and having a first magnet arrangement disposed outside of the recess, wherein the IC package has a second surface opposite to the first surface and has a first electrical contact element on the second surface; and a second socket having a second electrical contact element and having a second magnet arrangement. The first and second electrical contact elements may be aligned when the IC package is disposed in the recess, the IC package is disposed between the first and second sockets, and the first magnet arrangement is in a predetermined equilibrium relation with the second magnet arrangement to mate the first and second sockets.

Alignment fixtures for an integrated circuit packages

Placing integrated circuit devices using a perturbation is described. In one example, a testing platform has a circuit board. A socket is on the board for receiving and connecting to an integrated circuit package. The socket has an array of pins to engage connection bumps on a surface of the package and a biasing feature to guide the package into alignment with the pins of the socket. A perturbation source induces movement of the package into alignment with the pins of the socket.

Placing integrated circuit devices using perturbation

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Hillsboro, OR, United States of America

Rene J Sanchez