Invensense, Inc.

Sensirion Ag

Rene Hummel

Chung-Hsien Lin

Tsung Lin Tang

Wang Shen Su

Chia Min Lin

Ulrich Bartsch

Stefan Thiele

Johannes Schumm

Marion Hermersdorf

Andreas Reinhard

Thomas Kraehenbuehl

Felix Mayer

Marc Von Waldkirch

Stephan Braun

Robert Sunier

Johannes Buhler

Cyrill Kuemin

Ralph Steiner-Vanha

Chia Ming Lin

Tsung-Lin Tang

Chia-Min Lin

Wang-Shen Su

A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

Pressure sensor

A sensor includes a deformable membrane that deflects in response to a stimuli. The sensor further includes a capacitive element coupled to the deformable membrane. The capacitive element is disposed within an enclosed cavity of the sensor. The capacitive element changes capacitance in response to the deformable membrane deflecting. The capacitive element comprises a getter material for collecting gas molecules within the enclosed cavity.

A pressure sensor comprises a first substrate containing a processing circuit integrated thereon and a cap attached to the first substrate. The cap includes a container, a holder, and one or more suspension elements for suspending the container from the holder. The container includes a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. The container is suspended from the holder such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit.

Reduced stress pressure sensor

A pressure sensor comprises a deformable membrane deflecting in response to pressure applied, a first stationary electrode, and a second electrode coupled to the deformable membrane, for determining a change in a capacitance between the first and the second electrode in response to the pressure applied. At least one of the first and the second electrode comprises a getter material for collecting gas molecules.

Pressure sensor with deformable membrane and method of manufacture

A sensing device has a semiconductor substrate with an opening and a membrane spanning the opening. A heater is arranged on the membrane. To reduce the thermal conductivity of the membrane, a recess is etched into the membrane from below.

Membrane-based sensor device with non-dielectric etch-stop layer around substrate recess

The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighboring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.

Sensor chip and method for manufacturing a sensor chip

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Baar, Switzerland

Rene Hummel