Siemens Aktiengesellschaft

Rolls-royce Deutschland Ltd & Co. Kg

Rene Blank

Bernd Müller

Klaus Wilke

Stefan Nerreter

Jörg Strogies

Martin Franke

Rüdiger Knofe

Peter Frühauf

Ulrich Wittreich

Matthias Heimann

Michael Hanisch

Nora Jeske

Marco Matiwe

Dennis Sommerfeld

Kay Jarchoff

Carsten Borwieck

Various embodiments of the teachings herein include a method for monitoring a flux application in a soldering process. An example includes: defining flux wetting surfaces in relation to an image of an application surface; generating a thermographic recording of the application surface selectively provided with liquid flux; defining adjustment points on the application surface which can be identified on the image and on the thermographic recording; superimposing the image and the thermographic recording on the basis of the adjustment points; and comparing the position of temperature anomalies on the application surface identified by the thermographic recording with the position of the flux wetting surfaces on the image.

Monitoring a flux application

The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (), characterized by at least one separating element () formed in the wiring carrier plate (), which separating element divides the wiring carrier plate () into sections separated by the separating element (), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks () arranged on the wiring carrier plate (), and power semiconductors ().

Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement

Various embodiments include a semiconductor component comprising: a first carrier part; a second carrier part arranged opposite the first carrier part; a semiconductor element arranged between the first carrier part and the second carrier part; a contact surface arranged on one of the parts; a contact sleeve arranged on one of the carrier parts opposite the contact surface; and a contact pin with, at one axial end, an end face providing an electrical contact connection of the contact surface and, in a region averted from said axial end, a connection region for the connection of the contact pin with the contact sleeve by means of press fitting. At least one of the first carrier part or the second carrier part comprises a printed conductor connected to the contact surface and/or to the contact sleeve.

Semiconductor component and method for producing same

Various embodiments include an electrical assembly with: an electronic switching element electrically contacted on an underside and arranged on a flexible first wiring support; wherein the electronic switching element is electrically contacted on an upper side lying opposite the lower side; and a second wiring support arranged lying opposite the first wiring support on the upper side electrical contacting area of the electronic switching element. The first wiring support and the second wiring support each comprise a permanently elastic, electrically insulating, thermally conductive material.

Electrical assembly

Growing community of inventors

Berlin, Germany

Rene Blank