Komatsu Corporation

Rencai Chu

Kanichi Kadotani

Toshinobu Tanimura

An objective of the present invention is to provide a thermoelectric module which can achieve high heat release and heat absorption efficiencies and which can obviate any thermal stress-caused damages. A thermoelectric module ( ) in an embodiment has a predetermined number of thermoelectric semiconductor elements P and N which are arranged in a flat plate configuration. Each of the thermoelectric semiconductor elements P and N has on one face thereof a one-side electrode ( ) and has on the other face thereof an other-side electrode ( ), thereby allowing all of the thermoelectric semiconductor elements P and N to be connected in series. The one-side electrodes ( . . . ) have heat release/heat absorption fins (heat transfer fins) ( F, F . . . ) and the other-side electrodes ( . . . ) have heat release/heat absorption fins (heat transfer fins) ( F, F . . . ).

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Atsugi, Japan

Rencai Chu