Sgs-thomson Microelectronics S.r.l.

Stmicroelectronics S.r.l.

Renato Poinelli

Mauro Mazzola

Roberto Brioschi

Paolo Casati

Roberto Rossi

Marziano Corno

Stefano Ferri

A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink.

Method for manufacturing semiconductor device packages

A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

Offset edges mold for plastic packaging of integrated semiconductor devices

A method for forming a plastic package for a power semiconductor electronic device to be encapsulated within a plastic case and to be coupled thermally to a heat sink element having a major surface exposed and at least one peripheral portion extending outwards from at least one side of the plastic case. The method forms the plastic case of the package by molding inside a main cavity of a mold after positioning a heat sink element in a suitable housing provided in a lower portion of the mold which opens into the main cavity of the mold. The method forms the heat sink element such that at least side surfaces jutting out of said side of the plastic case are, at least in a zone adjacent to that side and in the peripheral portion, inclined to form an angle .alpha. substantially greater than zero with a normal line to the major surface, so as to have a negative slope from outside. The housing is formed such that its inner walls face the side surfaces of the heat sink element are inclined, at least in that zone, to form an angle substantially equal to the angle .alpha. with the normal line, with a positive slope from the housing interior. Thrust means engage from above with at least part of the peripheral portion of the heat sink element to exert thereon a compressive force substantially toward the housing bottom, thereby hermetically sealing the side surfaces of the heat sink element and the inner walls of the housing in the zone adjacent to said side of the plastic case during molding.

Method and mold for manufacturing a plastic package for an electronic

A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

Plastic body surface-mounting semiconductor power device having

The present invention relates to a heat-dissipating and supporting structure for a semiconductor electronic device to be encapsulated within a molded plastic material package, of the type having an insulated inner heat sink. In particular, it comprises a heat-sink element which has a first largest surface to be insulated by means of a plastic material layer with a first thickness, and a second largest surface, opposite from the first, to be insulated by means of a layer of plastic material with a second thickness which is thin compared to the first thickness; and a leadframe consisting of a metal strip attached to the heat-sink element on the same side as the first largest surface and comprising a peripheral holder structure located outside the heat-sink element. Formed in a portion of a side surface of the heat-sink element, is a relief which has mouths located on the first and second largest surfaces of the heat-sink element, the mouth formed on the first largest surface is substantially blocked by an obstructing means which extends to the heat-sink element outside, toward the peripheral holder structure, such as to only leave a slit open between the obstructing means and the peripheral holder structure of the leadframe next to the first largest surface of the heat-sink element. The mouth formed on the second largest surface is open wide.

Heat-dissipating and supporting structure for a plastic package with a

A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means. Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator. According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.

Leadframe for supporting integrated semiconductor devices

A robotized handling and transfer system for magazines of different configuration for semiconductor devices production lines utilizes magazines which are provided with standardized pick-up implements receiving elements and with an identification bar code affixed in a geometrically fixed spatial position in respect to the receiving elements. A mobile arm of the transfer robot is provided with an expansion type pick-up head, suitable for any kind of magazine. Upon each pick-up action, the mobile arm presents the picked-up magazine to a bar code reader mounted on the self-propelled robot for determining the type of magazine and consequently the area where the latter is to be deposited. The pick-up expansion head accesses from above a space confined by the structure of the magazine so it does not encumber stacking or arranging the magazines closely together.

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Casatenovo, Italy

Renato Poinelli